A look at what’s new in Nuremberg

At SMT Hybrid Packaging visitors will experience the diversity of assembly and interconnection technologies in a new setting as the well- established exhibition in Nuremberg moves to halls 4, 4A and 5.

  • Hall 5 contains exhibits related to “System Development and Production Preparation” as well as “Materials and Components.”
  • Hall 4 focuses “Processes and Manufacturing.”
  • The new hall 4A showcases “Reliability and Test” and “Software and Production Control.”

Another new feature this year is the Bavarian cluster “Mechatronik & Automation” exhibiting for the first time.

The Cluster wants to push an active communication between research and industry. Therefore, the non-profit organization in the field of technical business support as well as technology and knowledge transfer has created and developed several networks for purchasing SMD components, marketing surplus components, and capacity balancing between EMS companies in the last few years


ASM Assembly Systems 

HALL 4, STAND 309 

ASM Assembly Systems is literally placing the Smart #1 SMT Factory at the center of attention at its booth. Under the RSF Dome, the technology leader will demonstrate its new ASM Remote Smart Factory communication platform in combination with a highly flexible ASM SMT line. Show visitors can experience ‘live’ how manufacturers can raise their process and product quality via a remote support network paired with tools like smart glasses and smartphones. ASM Remote Smart Factory provides a secure global link between equipment supplier and electronics manufacturer, putting ASM support specialists and process experts within easy reach. With around-the-clock accessibility and predictive maintenance support, ASM Remote Smart Factory enables manufacturers to reduce their operating costs significantly. They can also use the networking platform as an in-house tool for seamless factory-to-factory communication.

With around-the-clock accessibility and predictive maintenance support, ASM Remote Smart Factory enables manufacturers to reduce their operating costs significantly.

With its presence at the 2017 SMT Hybrid Packaging show, ASM Assembly Systems demonstrates once again its leadership in smart SMT production solutions. This year the main focus will be on the translation of theoretical Industry 4.0 concepts into practical solutions for European SMT factories.

For more information about ASM products being shown at this year’s SMT Hybrid & Packaging show, visit www.asm-smt.com/en/smt2017 


CyberOptics

HALL 4, STAND 101

CyberOptics will display an advanced Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the CyberOptics’ SQ3000 3D Automated Optical Inspection (AOI) system.

CyberOptics has advanced the proprietary Multi-Reflection Suppression (MRS) sensor to an even finer resolution. The Ultra-High Resolution MRS sensor will be an option available for the award-winning SQ3000 3D Automated Optical Inspection (AOI) system. This sensor enhances the SQ3000 3D AOI platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical.

CyberOptics’ CyberGage360 3D Scanning and Inspection system and SE600 SPI system will also be demonstrated.

 


Rehm Thermal Systems 

HALL 4A, STAND 100 

Under the slogan “Turn Vision into Reality,” Rehm Thermal Systems will exhibit innovative solutions including several newly-developed systems, e.g. for contact soldering, cold function testing and conformal coating applications. In the area of smart data and networking, Rehm will present the new ViCON software with touch-screen interface.

The software can monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.

Rehm will be showcasing the following equipment and tools at SMT 2017:

Our best-in-class system for reflow convection soldering with or without a vacuum is now even more efficient using new EC fan motors, which are not only quieter and more sustainable, but also enable comprehensive data collection, a more effective cooling line and design tweaks.

The compactness of the VisionXC, which combines all the important technological features in the smallest of space, is impressive. The VisionX series also has ViCON software with new features and a modern user interface.

The software can, for example, monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.

Rehm will also exhibit the CondensoXC vapor phase soldering system, the Nexus vacuum soldering system, the Securo Minus cold function test system and the Protecto conformal coating system.


ULT AG – Hall5 

STAND 312 

ULT AG will introduce a new extraction and filtration device for small and medium pollutant quantities. Extraction and filtration units are utilized for air purification in electronics manufacturing. They remove airborne contaminants contained in emissions, such as laser fume, soldering fume, adhesives or welding fume.

Due to its modular design, the new device generation achieves an unrivaled level of flexibility, as the systems can be adjusted to changing production conditions according to the pollutant type and quantity.

The new device generation achieves unrivalled flexibility, as the systems can be adjusted to changing production conditions according to the pollutant type and quantity.

The all-new vacuum stabilization guarantees a constant capture rate, with the unit increasing performance should the filters become saturated. The units are also capable of maintaining the required performance level even if there are several capturing elements, such as extraction arms or hoses attached to the system.


K urtz Ersa 

HALL 4, STAND 111 

HALL 5, STAND 434 

Kurtz Ersa plans to exhibit the new VERSAFLEX-Ultra selective solder module. The VERSAFLEX-Ultra selective solder module offers unlimited flexibility, productivity and uncompromising quality – two solder pots, either y- and x-variable or z-variable, equipped with different solder and different solder nozzles, can work in parallel.

With its revolutionary flexibility, the soldering pots are able to move freely in x-, y- and z-direction. Each soldering pot is completely independent and has no y- or x-dependencies to the other one. An anti-collision software ensures the free movement of the servo-driven axis system of the soldering pots.


Microtronic GmbH 

HALL 5, STAND 221J 

Microtronic GmbH will introduce its new LBT210-HD (Heavy duty) Solderability Tester.

With the launch of the LBT210-HD, the maximum weight of a part that can be tested is now for forces up to 300mN instead of 40mN on the standard LBT210. The system is operated by using molten solder and measures the wetting force of the molten solder to the test part. This ensures a true value of the solder process. The system supports measurements using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.

Microtronic GmbH will also show the Sonix ECHO scanning acoustic microscope. The ECHO enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.

The ECHO VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. The ECHO Pro adds fully automated handling for 100 percent package inspection in high-volume production environments.


KYZEN Corporation 

HALL 4A, STAND 536 

KYZEN will introduce the new KYZEN ANALYST in Europe. KYZEN will have live, on-site demonstrations of their latest innovation, the KYZEN ANALYST.

The KYZEN ANALYST is the first of its kind, state-of-the-art wash bath concentration monitoring and reporting system that maximizes performance of virtually all chemistries, not just a few.

The KYZEN ANALYST is a state-of-the-art wash bath concentration monitoring and reporting system that maximizes performance of virtually all chemistries, not just a few.

The KYZEN ANALYST makes concentration monitoring faster, safer and more precise while saving critical time and money. Providing real-time access to data, analytics and reporting anytime, anywhere, the KYZEN ANALYST makes retrieving, logging and charting SPC reports fast and user-friendly. Additionally, it provides complete monitoring of wash bath concentration.

The KYZEN ANALYST features a user-Friendly 7” LCD Touchscreen Interface, Ethernet / WiFi connection, and is Industry 4.0 enabled to easily collect and exchange data.


SmartRep 

HALL 4, STAND 219 

After the successful rollout of the E by SIPLACE placement solution, ASM Assembly Systems is now following up with the E by DEK. Like the E by SIPLACE before, the new printing platform for mid-speed applications, high mix and prototype productions sets totally new standards in terms of quality, performance and modularity with core cycle times of 7.5 seconds incl. print and a repeat accuracy rating of ±12.5 μm @ 6 Sigma.

The new printing platform for mid-speed applications, high mix and proto-type productions sets totally new standards in terms of quality, performance and modularity

ASM distributors will offer the E by SIPLACE and E by DEK machines mostly as a line solution – features, such as a joint line monitor deliver additional benefits when both are employed together. Previously successful mostly in the high-end segment of electronics production, ASM is using the E-line to further advance its successful entry into new customer segments.


SEHO Systems GmbH 

HALL 4, STAND 129 

SEHO Systems GmbH will focus on automating the process. The selective soldering system SEHO SelectLine-C has been even further optimized.

SEHO will also introduce its new cross sensor at the exhibition that takes over several functions. On the one hand, the wave height is precisely controlled. The measurement is made touchless directly at the solder nozzle and it is fully independent from the solder alloy used. In addition, the cross sensor is also used for automatic tool measurement: diameter, height and mounting position of the solder nozzle are automatically controlled, thus excluding potential operator errors.

Also new and being introduced for the first time, is an automatic nitrogen flow quantity control.

 


SMT Xtra 

HALL 4, STAND 409 

SMT Xtra, a leading provider of productivity enhancing solutions for the global surface mount electronic assembly sector will celebrate 10-years of providing cost savings to the surface mount industry

The company will showcase a range of its SMT nozzles, feeders, spare parts and printer parts.

ISO 9001:2008 certified, SMT Xtra specializes in providing quality SMT production spares and consumables to a global customer base. The company is able to export worldwide thanks to its professional dedicated team of experts. SMT Xtra has a powerful purchasing network alongside excellent manufacturing facilities, enabling the company to pass on the savings to its customers.

0

Start typing and press Enter to search