Smart Starts Here EXPLORING SEMICON WEST

Smart Starts Here

SEMICON West is setting the pace with engaging, new experiences and networking venues—all to put you face-to-face with more qualified customers and partners than ever before.

SEMICON West connects the entire extended supply chain, all in one place and at one time. You’ll connect with the best in the business – from materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as flexible hybrid electronics, MEMS and sensors, and more. It’s the premier place to re-connect with your contacts and make new ones to drive your business forward.

Why SEMICON West? 

It’s here that the industry gets a glimpse at what’s next and finds its innovation engines. SEMICON West 2017 features more than 600 exhibitors and 115 hours of programs and networking opportunities to provide the insights, access, and technical and business intelligence you need to get ahead and embrace today’s disruptive landscape.

Do you know where the industry is headed? Do you have access to your customers – and theirs? Three days of presentations and all-new networking events provide everything you need to keep up with our rapidly evolving industry. And immersive, new experiences demonstrating advanced technologies and applications like Smart Automotive, Smart Manufacturing, Smart MedTech, and IoT make this year’s Expo like no other before.

VITAL SEMICON West

INFORMATION

SEMICON West, the flagship event for connecting the electronics manufacturing supply chain and adjacent segments, will be held July 11-13 at Moscone Center in San Francisco, Calif. The event includes programs on 5G, Advanced Manufacturing, Advanced Packaging, Test, MEMS and Sensors, Materials, in addition to the SMART focus (Automotive, Manufacturing, and MedTech). For more information, visit www.semiconwest.org. Register now for best pricing.

SEMICON West Drives SMART Automotive – Programs Reveal Road Ahead

Given the explosive growth of electronics in automobiles – from infotainment to driver assistance – SMART Automotive is in the spotlight. As automobiles become mobile computing platforms, they require more intelligence, speed, and memory to meet ever-increasing requirements. The industry is responding with a new generation of ICs, sensors, telematics, artificial intelligence, embedded software, and machine learning solutions designed to enable advanced automotive systems, including powertrain control, connectivity, infotainment, security and safety mechanisms, and more.

In conjunction with SAE International (Society of Automotive Engineers) and other key players in the segment, SEMICON West 2017 will feature several informative sessions covering the microelectronics innovations that are revolutionizing the driving experience and driving demand for chips. SEMICON West’s new SMART Automotive sessions will provide an insider’s view into this rapidly accelerating market:

• From ADAS to Autonomous Vehicles — (R)evolution Driven by New Technologies – Luca De Ambroggi, IHS Markit

• New Generation of Automotive Semiconductors Self-Test Solutions – Stephen Pateras, Ph.D., Mentor Graphics

• Artificial Intelligence (AI) and Self-driving Cars – Tim Wong, NVIDIA

• Accelerating the Future of the Connected Car – Nakul Duggal, Qualcomm Technologies

• Range Extension through Energy-efficient Connected Automated Driving – Brian McKay, Continental Automotive Systems

• Accelerating Autonomous Technology for Safety – David Agnew, Hyundai MOBIS

• IoT Cybersecurity –An End-to-End Business – Simon Hartley, RunSafe Security

• Accelerating ADAS System-on-a-Chip (SoC) Development with ASIL Certified IP – Ron DiGiuseppe, Synopsys

The Smart Automotive sessions will provide insights into the technologies, performance upgrades, and market trends shaping the future of the automotive industry and changing the world. The sessions are scheduled for Tuesday, July 12 from 10:30am to 12:35pm and 2:00 to 4:00pm. In addition, SEMI is planning to stage live demonstrations of some of the latest innovations behind today’s autonomous vehicle revolution.


■ KYZEN MICRONOX MX2707.

KYZEN 

BOOTH 6072

The KYZEN booth will feature MICRONOX 2707 for Cu pillar Flip chip applications.

MICRONOX MX2707 is designed for the demanding cleaning challenges presented by leadless devices such as BGAs, Flip chips, QFNs, LGAs and passives. It is optimized to remove organic acid residues of all kinds at low operating concentrations.

MX2707 is a multi-metal safe cleaning chemistry for advanced packaging. Used at low concentrations, MX2707 is safe on exposed metal and effectively cleans under highly dense die.

www.kyzen.com 


Quadra 7 X-ray Inspection system.

NORDSON

BOOTH 5644

Both Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation will be present. The Nordson Test & Inspection team will showcase a suite of award-winning systems targeted at both the Semiconductor and PCBA markets, including the Quadra 7 X-ray Inspection system, M1m AOI system and 4800 Advanced Wafer Testing Bondtester.

Nordson DAGE’s flagship system – the new Quadra 7 with 0.1μm sub-micron feature recognition – comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP detector. 4K UHD offers up to 4 times the detail compared to standard HD display screens and supports 68,000X total magnification.

The Nordson YESTECH M1m AOI system offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submicron levels and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 m2.

The Nordson DAGE 4800 Advanced Automated Wafer Testing bondtester is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm.

www.nordsondage.com

www.nordsonyestech.com


■ Virtual Industries Inc.’s TWEEZER-VAC Elite.

VIRTUAL INDUSTRIES, INC.

BOOTH 7313

Virtual Industries Inc. will demonstrate the TWEEZER-VAC Elite and ADJUST-A-VAC Elite.

The TWEEZER-VAC Elite (TV-1500-ELITE) was developed in response to customer concerns about firmly grasping critical components and not dropping them due to a vacuum leak. This vacuum tweezer uses an integrated ten segment bar-graph display that visibly shows the vacuum level present during operation. Additionally, the vacuum port integrates a user replaceable inlet filter that protects operation of the tool from dust particles.

The TWEEZER-VAC Elite is available in various kits depending on your handling application. Kits are available in 110 or 220 volt operation.

The ADJUST-A-VAC Elite (AV-5000-MW8) was developed in response to customer concerns about manual handling of very thin/delicate substrates, wafers, MEMS devices and other very fragile components. This vacuum tweezer allows the operator to adjust the vacuum level from just below atmospheric pressure to up to ten inches of mercury, depending on the fragility of the part being handled.

An integrated ten segment bar-graph-display visibly shows the vacuum level present during handling operations. Like the TWEEZER-VAC Elite, the system features an integrated bar-graph display and replaceable inlet filter that protects operation of the tool from dust particles.

www.virtual-ii.com 


■ CyberOptics’ WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR).

CYBEROPTICS CORPORATION

BOOTH 6562

CyberOptics Corporation will demonstrate the WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR).

CyberOptics’ unique AMS/AMSR portfolio measures leveling, vibration, and relative humidity (RH) in an all-in-one, wireless, real-time device. Using the wafer or reticle shaped sensor with MultiView/MultiReview™ software, fab engineers can easily conduct diagnostics and see the effects of adjustments in real-time. AMS/AMSR speeds equipment alignment and set-up, lowers maintenance expenses and enhances process uniformity with objective and reproducible data.

CyberOptics will also showcase the widely adopted Airborne Particle Sensors (APS2/APSRQ) used to wirelessly monitor and troubleshoot airborne particles down to 0.14μm and up to 30μm bin sizes within semiconductor process equipment and automated material handling systems. The sensors quickly identify when and where the particles originate and measure the effectiveness of cleaning adjustments and repairs in real-time – saving significant time, expense and resources.

www.cyberoptics.com 

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