SMT Association News: November 2017
Nate Carson, Director of Business Development at IPC
IPC—Association Connecting Electronics Industries announced the addition of Nate Carson as Director of Business Development to its staff at IPC headquarters in Bannockburn (Chicago), Ill.
Carson has extensive experience managing global accounts within the automotive, electronics, telecom and high reliability sectors. In his role as director of business development, Carson will be focused on expanding both the industry engagement and global footprint of IPC products and services.
He will accomplish these goals by networking and negotiating with distributors, training centers, and other alliance partners globally. He will be responsible for existing alliances as well as finding new channels for business. Carson’s skills in identifying opportunities and global account management will be leveraged as IPC continues to grow and add value to members worldwide. His role will touch many IPC departments, including Member Success, Technology, Marketing, Accounting and Customer Service.
“IPC is thrilled to have such a high caliber talent like Nate Carson join our team,” said Sanjay Huprikar, IPC Vice President Of Member Success. “Nate’s global experience and dedication to the industry will enhance IPC’s ability to continue to deliver strong value to our members.”
IPC Soldering Competition to “Heat Up” productronica 2017
In cooperation with productronica 2017, IPC—Association Connecting Electronics Industries is presenting its very popular Hand Soldering Competition in Hall A1, Stand 307 at this year’s event. Skilled competitors will demonstrate their soldering skills, on 14-16 November, as they compete for cash prizes: 1st place—€300; 2nd place—€200; 3rd place—€100. New this year, IPC will feature the World Hand Soldering Championship on 17 November, 2017, with the regional winner from productronica and competitors from around the world. The winners of the IPC HSC World Championship will receive cash awards amounting to: 1000€ to the winner, 500€ for the runner up and 300€ for third place. The awards will be presented Friday, 17 November at 14:00 in the SMT speakers corner Hall A1, Stand 220.
Hand soldering of high density printed boards demands highly skilled operators to ensure a zero-defect soldering process, and this competition will recognize the best skills in hand soldering complex printed board assemblies. Over three days, participants will compete against each other to build a functional electronics assembly within a 60-minute time limit.
Assemblies will be judged on soldering in accordance with IPC-A-610F Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors from IPC licensed master training centers will serve as the judges.
Competition entries will be accepted until 1 November, via this link: hsc-productronica. Participation is limited and competitors will be selected on a first-come, first-served basis. For more information contact Lars Wallin, IPC European representative, at LarsWallin@ipc.org.
IPC thanks Hand Soldering Competition Gold Sponsors: JBC Tools, Kurtz Ersa, Weller; Silver Sponsors: Almit GmbH, Balver Zinn GmbH, and NCAB Group; Bronze Sponsors: IFTEC, PIEK International Education Centre, Optilia, MicroCare, ULT and Weidinger; and contest Contributor Sponsor: Microsolder, for their support.
SMTA International 2017 Concludes Successfully
The 2017 SMTA International Conference and Exhibition, which took place September 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL, concluded successfully. A record number of international attendees from 22 countries were registered this year.
The technical conference continued the tradition of being the strongest in the electronics assembly industry. The Technical Innovations Symposium at the beginning of the week received much praise as it covered Micro-Dispensing and Additive Manufacturing Developments, Adhesive and Coating Development and Characterization, and a Lead-Free Current/Future Presentations Panel Discussion. The Technical Innovations Symposium keynote presentation by iNEMI’s Bill Bader on the 2017 Roadmap Highlights was well-received by attendees.
The Women’s Leadership Program brought together speakers from IBM, Intel, FLITE, WNIE, and Women in Manufacturing on Monday afternoon. The program closed with a panel discussion about diversity in the workplace followed by a wine and cheese reception.
On Tuesday morning a crowd filled the Keynote Presentation Session until it was standing-room-only to hear Microsoft’s GM of HoloLens Hardware Design, Rune Jensen, share his experiences developing the company’s premier mixed reality device. The presentation included several videos demonstrating the advanced capabilities of the HoloLens. The presentation inspired attendees to imagine how a device like this could change the future of manufacturing.
The Lead-Free Soldering Technology Symposium as well as the expanded Advanced Packaging, Manufacturing Excellence, Inspection Technologies, and HDP Consortium tracks kept the meeting rooms full until the very end of the conference on Thursday.
Over 170 exhibiting companies filled the exhibit hall bringing more equipment and new products than past years. Traffic on the show floor was noticeably higher this year.
Once again the Tech Tour program featured distinguished tour guides leading groups of attendees to exhibiting companies demonstrating new products and test equipment.
Next year, the SMTA International Conference and Exhibition will be held October 14 – 18, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The IPC Fall Standards Development Committee Meetings will again be co-located.