SMT & Packaging Association News – February 2018
IPC North American EMS and PCB Statistical Programs Open
IPC’s statistical programs for the rigid printed circuit board (PCB), flexible circuit and contract electronics manufacturing (EMS) industries in North America are now open to new participants for 2018. The deadline for IPC members to sign up is February 2. Participation is free to IPC-member companies as a benefit of membership.
The statistical programs give participating IPC members access to timely market and management data that would be impossible for them to collect themselves and prohibitively expensive for individual companies to obtain from research firms. As a neutral and trusted third party, IPC collects sales, orders and other business data from the participating companies using a secure and confidential online survey system. In exchange, these companies receive the aggregate data monthly and comprehensive quarterly reports that reveal the latest market and management trends for the industry.
Participating companies use the data in their marketing, sales, planning and financial activities. It helps them to track changes in their market shares, compare their business performance against industry averages in their size tiers and product segments, and identify growing and declining markets.
These statistical programs have been running for decades. Participants are both public and private companies of all sizes, including many of the region’s leading PCB and EMS companies. IPC members interested in participating this year can sign up by contacting IPC at email@example.com or by phone at +1 847-597-2868, by February 2.
SMART Group to become SMTA Europe
SMART Group became SMTA Europe effective January 1, 2018. SMTA Europe will continue to host meetings in the UK, but will also support manufacturing regions in mainland Europe with additional educational programs and technical resources.
Members of both organizations will benefit with expanded opportunities to connect across the globe as well as mutual access to thousands of technical papers and online content.
This announcement comes months after the successful Contamination, Cleaning and Coating Conference co-organized by SMTA and SMART Group in Amsterdam. Plans are already underway for a 2018 conference in Amsterdam addressing Electronics in Harsh Environments.
“In this fast changing environment, industry associations can struggle to remain relevant and this will ensure that our growth continues,” said Keith Bryant, Chairman of SMART Group. “SMTA is a global organization with a huge reach. Together we will offer our members unrivalled events and support, increasing their knowledge, helping those overcome problems and become more successful.”
“The SMART Group mission and values perfectly align with that of SMTA.” said Tanya Martin, Executive Director for SMTA. ”The SMART Group has built a solid foundation and we look forward to welcoming their members into our family. This is an exciting time for SMTA as we strive to expand our international presence and bring education and connections to electronics professionals around the world.”
If you would like to apply to join the SMTA Europe Technical Committee and help organize great events, please contact Tanya Martin, firstname.lastname@example.org.
2018 Pan Pacific Microelectronics Symposium Program Finalized
SMTA announced that the program is finalized for the 23rd Annual Pan Pacific Microelectronics Symposium. The event will take place February 5-8, 2018 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
The technical sessions, with over 50 presentations, will include Automotive Systems and Hardware, Materials and Reliability, Inspection and Test Techniques, Cleaning Technologies, Advanced Materials, Interposer and Packaging Technology, Advanced Processes and Packaging, Nontechnology Applications, Advanced Packaging and Processes, Advanced Process, Heterogeneous Integration.
On the afternoon of Monday, February 5, a plenary keynote session will kick off the event featuring presentations on Defense Electronics; The Latest Material Technologies for Systems in Package; Management of Complexity in Research and Development Work; and Selected Highlights From the 2017 iNEMI Roadmap and Key Projects to Address Identified Gaps.
On Tuesday, February 6, Yoshiaki Sakagami, Honda, will deliver the keynote lunch talk on “Honda’s New Mobility System Development Challenge; Key Functions and Devices for Intelligent Mobility System.” On Wednesday, February 7, Dwight Howard, Delphi Automotive, LLC, will deliver the lunch keynote on “Integrated Intelligent Transportation and Key Enablers.” Dongkai Shangguan, Ph.D., Flex, will deliver the final keynote lunch presentation about “Cost Effective Solutions for SiP and Miniaturized Modules” on Thursday, February 8.
View the complete program and register at the website: https://www.smta.org/panpac. Please contact Tanya Martin, email@example.com or 952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Karlie Severinson, firstname.lastname@example.org, for details.