SMTAi 2017 TRADE SHOW NEWS
TECHNICAL PROGRAM EXPANDS
SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 – 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.
The Advanced Packaging Technology track will tackle issues such as 2.5D Packaging, Embedded Power Electronics, and Warpage. Presentations by Fraunhofer IZM, I3 Electronics, Nokia, Intel and more are highly anticipated. The Manufacturing Excellence track includes research on cleaning, conformal coating, as well as recent developments from the HDPUG Consortium.
The Inspection Technologies track includes a full session on counterfeit component mitigation in addition to other areas like solder paste volume measurement, high volume manufacturing, conformal coating, and supply chain issues. The Lead-Free Symposium opens with recent findings from the AREA Consortium. The other sessions in the track cover Screen Printing, Reliability and Performance of Lead-Free Interconnections, and Innovation for High Reliability Electronics. For more information visit www.smta.org/smtai
iNEMI’s Bill Bader to Keynote Technical Innovations Symposium at SMTA International
SMTA announces that Bill Bader, CEO of iNEMI, will keynote the 2017 Technical Innovations Symposium on Monday, September 18, 2017. Bader’s presentation is titled “2017 iNEMI Roadmap Highlights Impacting Board Assembly over the Next 5-10 Years.” The iNEMI roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies. The keynote presentation will discuss the major trends that will impact board and component assembly in the near future, with insights to identify potentially disruptive innovations that could be the basis for radical changes to current programs and equipment.
Microsoft’s Jensen to Keynote SMTA International
Rune Jensen, Microsoft, will keynote SMTA International the morning of Tuesday, September 19 with his presentation “Experiencing Mixed Reality – using the Microsoft HoloLens.” Microsoft’s HoloLens is an untethered holographic computer that creates high-definition, 3D holograms using advanced nano-optics. These holograms become part of the real world through an array of sensors, which continuously sample the user’s environment. HoloLens combines all the processing and components in a form factor that enables interaction with the real and the virtual worlds – in a natural way. The ability to project 3D images into a user’s field of view has many exciting applications in the industrial space with the ability to provide real-time information or images fixed in-space to a real-world object.
Mike Konrad to Speak at SMTAI’s Distinguished Speaker Series
Mike Konrad will be speaking at SMTAI’s Spotlight Distinguished Speaker Series on Wednesday, September 20 (in the Spotlight Theatre located on the SMTAI show floor). The Spotlight Series features three speakers and takes place from 11:00 AM – 12:30 PM. Mike will be presenting the following paper: SMT Wars – Lesson Learned from an Electronic Contract Manufacturer and the Customer Who Sued Them What happens when an electronic contract manufacturer follows their customer’s instructions to the detriment of the product? Product failures, blame, drama, and a really big lawsuit.
This paper will review the trials and tribulations of a contract manufacturer and their customer. Assembly residue-related failures (ECM) contributed to product failures, product recalls, and, ultimately, a multi-million-dollar lawsuit. Misguided “best practice” techniques only made matters worse. This paper will discuss what factors contributed to the “perfect storm” of product failures. Factors that go as far back to original product designs, printed circuit board fabrication, storage and handling, assembly, testing, and coating. While mistakes were made all along the way, product failures could have been avoided with a few simple process changes, adding mere pennies to the cost of each assembly while saving hundreds of thousands of dollars in litigation.
ON THE SHOW FLOOR
Acculogic Inc. Booth #133
Acculogic’s Test Engineering division offers a comprehensive range of turn-key services that range from in-circuit test fixture and program development to sophisticated application development on custom functional test platforms. Company representatives will be available to discuss the following equipment: The Scorpion BRiZ is a unified automated test platform that can consolidate any variety of circuit board test and programming application into a single, compact, low cost test station. It is a low cost, scalable, reusable test fixture base that is in-line and capable of: functional test, in-system programming, boundary scan / JTAG, in-circuit test. The FLS980 Series III with the Ultimate Accuracy Package Option along with high throughput features such as the latest version Flying Bed of Nails (FBON). The new ThermoScan thermal imaging test solution and MicroScan miniature image observation and testing solutions also will be displayed. The SCORPION iCT7000 is a cost-effective, modular and expandable In-Circuit Tester, which can be configured with up to 8,192 pins. It is the ideal tester for those requiring a larger test node capacity.
Akrometrix Booth #124
Akrometrix, LLC, the provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, will display its newest warpage metrology system. The new Tabletop Shadow Moiré (TTSM) system responds to the industry’s demand for an ultra-fast tabletop warpage metrology system. The TTSM offers all of the software features of Akrometrix’s thermal warpage metrology systems, only at room temperature. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a
flexible/configurable platform. The TTSM enables customers to measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds.
Cogiscan Inc. Booth #1031
Cogiscan Inc., plans to showcase its Co-NECT Production Software which supports all existing and future industry standards such as SECS/GEM, CAMX, ZVEI, JSON, as well as proprietary interfaces from leading software and machines vendors. Cogiscan’s Co-NECT is a unique, standalone and neutral connectivity solution that addresses the greatest challenge in the industry at this point: Connectivity between different machines, software and enterprise systems. This technology enables Industry 4.0 for electronics assembly. The Cogiscan Co-NECT connectivity layer enables data exchange in real-time in very large manufacturing sites with hundreds of machines.
Conecsus Booth #1028
Conecsus, LLC, an innovative environmental technology and recycling company. Conecsus’ representatives will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market. Conecsus’ Tom Mitchell, North American Business Manager, will discuss what Conecsus does and how its recycling technology benefits the SMT/PCB electronics manufacturer, how the system works, and how it represents a new way of dealing with metals-contaminated waste in an increasingly environmentally-conscious manufacturing world.
EVS International Booth #1206
EVS will show the EVS 500LF Solder Recovery System. With the new concept of improved performance plus the significant reduction in price, everyone can enjoy the savings that EVS solder recovery systems can offer. The EVS500LF is designed to ensure that the maximum recovery is maintained throughout the life of the wave solder system. Users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross. EVS has continually improved the performance of the EVS units and the new EVS 500LF is no exception. The EVS 500LF has the same footprint as a printer and is aimed at multiple markets: The customer with one lead wave and one lead-free wave; the customer who uses Nitrogen or wants to reduce their Nitrogen usage; the customer with selective solder pots who only removes small amounts of dross every hour; or the customer with multiple waves where one EVS 500LF is connected to each wave.
Indium Corporation Booth #517
Indium Corporation will feature its ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®— Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies. The flux chemistry is specifically engineered to improve reliability with: High ECM performance under low standoff components Outstanding solder beading Very low bridging, slump, and solder balling Resistance to head-in-pillow Excellent wetting to a variety of common fresh and aged metallizations and surface finishes High print transfer efficiency with low variation Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.
Juki Automation Booth #1131
Juki Automation Systems plans to show several new products, including the brand new ISM UltraFlex 1800, AXI5100c inline X-ray component counter and RS-1 Placement Machine. The UltraFlex 1800 is able to dynamically adjust the internal subdivision of space to accommodate changing mixes of reel heights from 8 up to 88mm, and diameters from 7 to 15”. The new case designs allow storage of JEDEC trays on ANY case format (both 7 and 15” wide). Capable of providing up to 54 reels for production simultaneously, the ISM1800 can read low parts, warning to output the required reel in advance.
The mid-speed RS-1 pick and place machine features one multi-function head New Head – the LNC120 with a 12mm pitch and eight nozzles as well as a diffuser for vision. The LNC-120 head laser moves up and down depending on component height, resulting in the highest CPH regardless of component height. Combined with the “new” RF electronic feeders, the system has an optimal throughput of 40,000CPH. With new odd-form recognition technology, the RS-1 provides easy data entry for odd-form parts.
KIC Booth #123
The KIC team will showcase the KIC ecosystem comprised of the brand new SPS Smart Profiler, RPI automatic profiling system, and the new Vantage with networked real-time dashboard. The KIC Vantage is an ecosystem that automatically acquires and delivers insightful information from all the ovens in the factory in real-time to allow engineers to produce consistent quality at lower costs. The software is retrofitable and can connect to the factory MES system. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup. The new thermal profiler features a small compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection and faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, private Wi-Fi for wireless data communication plus much more.
Kurtz Ersa Booth #335
Kurtz Ersa North America will demonstrate the HR 550 Rework system, Ersa Mobile Scope and i-CON VARIO 4. The HR 550 hybrid rework system features a 1,500W high performance hybrid heating element to desolder and solder SMT components up to 70 x 70 mm. A 2,400 W infrared bottom heater in three heating zones guarantees homogeneous bottom-side preheating of the complete assembly. The system addresses all users with the highest requirements in terms of precision and process safety in electronic assembly rework applications. The i-CON VARIO 4 offers whisper-quiet air and vacuum generation for up to four simultaneously operating soldering and de-soldering tools. The station ensures highly efficient processing of all SMT and THT soldering tasks. In addition to the 200W i-Tool AIR S, it offers the i-Tool Universal Soldering Device, the THT De-soldering X-tool Iron, and the Ultra-Fine De-soldering Chip Tool VARIO (2 x 40W). The Ersa Mobile Scope has been designed for optical inspection and digital image recording including measurements of solder joints on Ball Grid Array (BGA), μBGA, CSP and Flip-Chip packages. Further applications are top-view inspection of PCB lands, solder paste prints or the optical inspection of components on printed circuit boards in Surface Mount Technology (SMT) or in Trough Hole Technology (THT). The device can be used in quality control, production, laboratories or R&D departments.
Mek (Marantz Electronics) Booth #114
Mek Americas (Marantz Electronics), MEK, will be exhibiting their PowerSpector GTAz 350. The MEK PowerSpector GTAz 350 desktop AOI is designed for maximum defect coverage whilst maintaining short programming times. It is the only desktop AOI in the market that can be equipped with nine cameras: one top and eight side cameras. GTAz is the most versatile inspection engine from Mek, reliably inspecting SMT and THT component bodies for presence/absence, type, polarity, offset, text, colours etc. and components solder fillets for excessive, insufficient, no solder, shorts, lifted leads etc. Suitable for use in pre reflow, post reflow, post wave and post selective soldering, it can also be used for 2D solder paste inspection and first article inspection. MEK has over 6000 machines in use worldwide; the 24-bit imaging technology is driving powerful process control and maximum production yield for MEK electronics assembly and microelectronics customers everywhere.
MIRTEC Booth #606
MIRTEC will feature the award-winning MV-6 OMNI 3D AOI and MS-11e 3D SPI systems, as well as the all NEW MV-3 OMNI Desktop 3D AOI machine at this year’s event. The award-winning MV-6 OMNI 3D AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology which combines the 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary 8 Projection Digital Multi-Frequency Moiré 3D system in a newly designed cost effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s 8 Projection Digital Multi-Frequency Moiré Technology, provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to a 15 Mega Pixel Top-Down Camera. The MS-11e 3D SPI Machine is configured with MIRTEC’s exclusive 15 Mega Pixel CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection “Shadow Free” 3D Moiré Technology combined with a Precision Telecentric Compound Lens and Precision Laser PCB Warpage Compensation to accurately characterize each solder deposition post screen print. The MS-11e precisely measures solder volume, area, shape deformity and X/Y position and inspects for bridging between adjacent solder depositions.
Nordson Corporation Booth 515, 607, 1111, 1212
The Nordson Test & Inspection team will showcase a suite of award-winning systems including the Quadra™ 7 X-ray Inspection system and FX-940 ULTRA 3D AOI system. Nordson DAGE’s flagship system – the new Quadra™ 7 represents the cutting edge of X-ray inspection performance. 6.7 MP ultra-high quality images are displayed at full one-to-one resolution over two 4K UHD monitors ensuring you see the clearest features today, and for all your products in the future. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection.
Scienscope International Booth #229
Company representatives will demonstrate the AXC-800 X-ray component reel counter and X-SPECTION 6000 X-ray Inspection System. The table-top AXC-800 is an Automatic X-ray Inspection Component Counter designed for the inspection of components on traditional reels, from 01005 to odd form devices. However, this machine goes beyond standard inspection of components in 7” 13” and 15” reels, with the ability to inspect components in JEDEC trays (including BGA ball counting), ESD storage bags, storage tubes, or just about any form by using simplified algorithms built into the system for all types of components. If your component does not exist, you can add it using the user friendly GUI.
SEHO Booth #1325
SEHO North America, Inc. will highlight the SelectLine-C selective soldering system in an automated production line together with different modules from the SEHO Streamline product line IL. At SEHO, customers profit from complete solutions. With the aim of making production processes more efficient, SEHO completely automates production lines for board handling and material management, particularly in through-hole processes. Workplaces for assembly of electronic components, buffer and paternoster stations, turn stations, automatic lifts and, of course, the completely automated conveyor units in between are only a few examples.
STI Electronics Booth #818
STI Electronics, Inc. is a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, An IPC authorized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-A-600 and IPC-7711/7721, STI provides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses. STI’s Training Services division develops customized training courses to fit specific training needs. Typically, STI builds these classes around company-specific standards and specifications. Other courses include basic soldering, wave soldering, ESD training, BGA rework and many more. It also provides operator/inspector training for through-hole and SMT soldering, conformal coating, and training to the requirements of NASA-STD-8739.1 and NASA-STD-8739.4 for Marshall Space Flight Center and its support contractors. In addition to its standardized training program support materials, STI Electronics’ Training Materials division provides unique or custom training materials including Fine Pitch Lead Free Solder Training Kits. STI is an approved distributor for IPC training materials.
Viscom Booth #709
Viscom plans to exhibit the 3D AOI system – S3088 ultra gold. The S3088 ultra gold reaches image data rates of up to 3.6 gigapixels per second. The core of this system is the innovative high performance camera module XMplus with its outstanding, high throughput camera technology. The central innovation on the S3088 ultra gold is the 3D camera module XMplus with more than 120 megapixels. The image data rate is up to 3.6 gigapixels per second. In short, it takes everything the standard Viscom XM camera module offers and doubles it. The S3088 ultra gold also boasts an image field size of 50 x 50 mm and inspection speeds up to 65 cm2/s. Fields of view from up to nine perspectives enable exact 3D analyses, with which lifted leads, chip coplanarity and many other critical defects are reliably detected. This also applies to 03015 components.
Yamaha Booth #1023
Yamaha Motor Corporation, USA in partnership with Trans-Tec Worldwide, will exhibit dynamic new SMT assembly technology. The equipment being shown will include the YSM20 Modular Mounter, the YSP printer, and YSiV software. The Z:LEX YSM20 High-Efficiency Modular Mounter effectively accommodates a wide range of production processes while offering the world’s fastest placement performance in its class, 90,000 CPH / 63,500 CPH (IPC9850). It features large component handling capability, 03015mm to 55x100x28mm, large PCB handling up to L 810 x W 490 mm (dual stage, 1-board conveyor, single lane) or two boards up to L 810 x W 230 mm (dual lane). The YSM20 offers a maximum feeder count of 140 types. It features a high-speed head (10 nozzles) and a flexible multi-purpose head (5 nozzles) and is available in single or dual beam configurations. The YSP is a high-speed, high-precision universal high-end printer featuring an 11 sec/cycle line-tact high-speed printing capability, and 6σ: +/- 12.5 um repeatability of positioning. It offers YAMAHA’s unique PSC system (Print Stability Control) and is equipped with the innovative 3S head (3S: Swing Single Squeegee) for variable attack angle printing. Also on exhibit will be the user-friendly and intuitive YSi-V (AOI) inspection system software that makes the YSi-V not only an inspection tool but a process optimization enabler as well. YAMAHA will demonstrate the YSi-V via offline software.
YINCAE Booth #329
Dr. Wusheng Yin will be presenting his white paper, “High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste.” The presentation will be on held on Wednesday, September 20 at 9:00am in room FSA3. YINCAE Advanced Materials, LLC is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.