The two most important processes in surface mount electronics assembly are the stencil printing process and the reflow soldering process. These processes have many influential variables that control the process outcome. Achieving a desired outcome is very difficult if these process variables and their influence are not well understood and optimized. Read
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The brave new lead-free world of electronics assembly has cast a dark shadow over the electronics industry, especially in the realm of electronics reliability. The cost of conversion has already run up a price tag of more than $38 billion, according to a recent report, and still the frustrating fact is that no evidence of risk from lead in electronic solder has ever been produced. Add to that the facts that the US EPA produced a full life-cycle analysis of solders indicating that traditional tin-lead solder is more environmentally friendly than the much more expensive SAC alloys that are replacing them, and that tin metal has more than quadrupled in price since 2001. However, most frustrating is the fact that WEEE legislation obviated the problem by mandating recycling. Thus the electronics industry is left to try and make sense of all the madness and deliver products that will somehow meet with customer needs. Read
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New vice president at ERSA, USA
Ernie Grice has worked for ERSA for six years and has 20 years experience in the electronics manufacturing industry.
Specialty Coating Systems offers Parylene seminar
The seminar will appeal to engineers in many disciplines, including R&D, design, manufacturing, quality, materials and electronics, as well as to those involved in regulatory affairs and product management.
IPC announces HDI Technology Conference
IPC - Association Connecting Electronics Industries® will offer a three-day HDI Technology Conference: Building the Supply Chain Infrastructure, October 6–8, 2008 in Dallas, Texas.
Inside the July 2008 issue
of
Global SMT & Packaging magazine:
"Understanding hidden reactions and the importance of profile in reflow soldering, part 2" by Dr. S. Manian Ramkumar, Anand Kannabiran, Aarthi Baskaran, Dr. Viswam Puligandla, Bjorn Dahle
"Advances in solder ball placement for surface-mountable packages" by Tom Falcon
"Parallel print & inspection processes to achieve 100% post-print inspection" by Wolfram Hübsch
Company Profile: NBS Design
Interview: Don Naugler—VJ Electronix
SMTA International 2008 Show Preview
"SMART Group launches 'Lead-Free Process Defect Guide 2'" by Bob Willis
"Wafer level packaging and the third dimension" by Joe Fjelstad (North American edition)
"Seasonal upturn imminent but soft demand through 2009" by
Walt Custer and Jon Custer-Topai
"Update on lead-free solder joint reliabilitys" by
Werner Engelmaier
Do you have a technical solution
for the industry?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query,
contact Trevor Galbraith at editor@globalsmt.net.
