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Noticias de Ultima Hora
Major PCB industry suppliers headed to IPC Midwest Conference & Exhibition

The exhibition, targeted specifically at the electronics assembly and PCB manufacturing industries, will begin at 10 am on Wednesday, September 26 and run through 2 pm on Friday, September 28.

 
Vectron International completes acquisition of BiODE Inc.

Strengthens Sensor & Advanced Packaging Group's acoustic wave-based sensor offerings, represents strategic building block for future growth.

 
Hynix upsets the DRAM market with remarkable Q4 performance

Hynix Semiconductor Inc. pulled off a double upset in the DRAM market with a remarkable increase in shipments causing it to rise to the second rank for both the fourth quarter and for all of 2006, up from third previously, according to a preliminary ranking from iSuppli Corp.

 
SMTA call for abstracts

Abstract submission is now open for the upcoming AIMS Harsh Environment Electronics Workshop and Successful Lead-Free/RoHS Strategies Conference events to be held in June.

 
New cleaner for assemblies with sensitive metal alloys
Due to its mild formulation, VIGON® A 250 shows excellent material compatibility with sensitive metal alloys especially for long exposure times.
 
Tessera signs definitive agreement to acquire Eyesquad
Tessera expands its consumer optics offering with solid state auto-focus and optical zoom technologies.

 

 
Keithley recognized for outstanding customer satisfaction in semiconductor industry
VLSI has awarded Keithley a five star rating among process diagnostics companies, the highest possible rating for overall customer satisfaction

 

 
National Semiconductor acquires leading-edge data converter developer xignal technologies
Key technology and development expertise to accelerate national’s leadership position in high-speed data converters.

 

 
PPD-130 allows precision dispensing of dangerous or topic substances
I&J Fisnar's peristaltic pump dispenser provides accurate and repeatable deposits while maintaining a clean and safe bench environment.

 

 
XJTAG goes global and appoints multiple distributors to meet demand
Eight new distributors will provide the company with representation in 21 countries across Europe, the Far East, North America, the Middle East and Australasia.
 
Ultra-fast flow, reworkable CSP underfill is jet dispensible

Emerson & Cuming's XE-1218 cures in 4 minutes at 110°C and even faster at high temperatures. Also new: CE-3520-3 electrically conductive paste.

 
Cobar's Ineke Tiggelen-Aarden to present paper at APEX 2007.
The presentation, on better solder paste characterization for lead-free, is scheduled for Wednesday, February 21st at 1:30PM.

 

 
A.C.E. Production Technologies moves to larger facility

The move was prompted by unprecedented growth fueled by an increase in systems sales of over 500% in 2006, according to Al Cable, President.

 
IME develops advanced RF CMOS chip
The Institute of Microelectronics (IME) has once again broken new grounds in its development of RFID solutions with the demonstration of a silicon chip that enables low cost UHF (Ultra High Frequency) RFID reader/writer modules.
 
KIC wins VISION award for KIC Vision
KIC VISION is an automatic profiling system at the price of a manual profiler.

 

 
Milara receives coveted industry award for its bumping system
Milara Inc., vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, has been awarded a SMT VISION Award in the category of Printing Equipment for its innovative AWPb 300 Automatic Wafer Bumping System.
 
New desktop electroplating system for in-house prototyping
This table-top system is specially designed for the professional production of prototypes and small batch production PCBs.
 
Dage Precision Industries’ David Bernard at APEX Process Clinic

Dr. Bernard will offer free and unbiased technical advice to help visitors with common process problems, RoHS compliance issues and field failure analysis. 

 
EFD and Leister Technologies to hold laser soldering webinar

EFD Inc.'s Solder Paste Group and Leister Technologies LLC will be holding a webinar entitled "An In-Depth Look at Laser Soldering" on March 6, 2007.

 
How will innovative 3D packaging technologies impact the semiconductor food chain?
Allbizreport.com announces a new market research report related to the worldwide advanced packaging market that will be available to its catalogue starting the 10th of February.
 
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Entrevista del Dia

Entrevista con Isao Muraoka, Seika

Entrevista con Isao Muraoka, Seika Vicepresidente Ejecutivo

 

Detalles Pequeños

7.7 - Empaquetado de circuitos integrados – acercandose a 50 años de evolución

Mientras que el encanto del circuito integrado (CI) ha disminuido un poco durante las casi cinco décadas de su existencia, se ha puesto cada vez más de manifiesto en los últimos varios años que el funcionamiento de los chips de semiconductores están siendo bloqueado por el paquete del CI.

 

Detalles Sin Plomo

7.7 - ¿Cuál es entrenamiento en línea de LEADOUT?

La industria electrónica en Europa ha experimentado recientemente uno de los cambios más grandes desde que comenzó alrededor del 1960.

 

Negocios Globales

Actualización del mercado: Aterrizaje suave en curso...

Basado en data hasta mayo parece que el ciclo corriente del negocio mundial de semiconductores esta en su punto más bajo.

 

Blogs de la Industria

Mantente al dia con lo que sucede en la industria. Visita los blogs relacionados a la industra escojidos por el equipo de Global SMT (Blogs son en inglés)

Ultima Hora

ICI adquiere Advanced Applied Adhesives

ICI ha anunciado la adquisición de “Advanced Applied Adhesives” (AAA), un negocio de materiales electrónicos basado en San Diego , California , para añadir al grupo Materiales Electrónicos (EM por sus siglas an inglés). Los términos de la transacción no fueron divulgados. Lea mas...