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Noticias de Ultima Hora
F&S Market Leadership Award 2006 presented to ESSEMTEC AG

ESSEMTEC won the award for their complete product range, customer orientation and their high name recognition all over the world.

 
Venture Outsource electronics industry survey reveals valuable insight

Several hundred respondents from technology original equipment manufacturers (OEM), electronics manufacturing services (EMS) providers and original design manufacturing (ODM) companies, and suppliers to these companies, worldwide, completed the survey.

 
Lead free solder paste addresses first pass yield and rework rate concerns

Cookson Electronics' new ALPHA OM-350 lead-free solder paste delivers high first pass yield and low rework rates. 

 
Fume extraction for healthy lead-free rework

Concerned by the acrid odour given off by lead-free fluxes and solder pastes, rework professionals are increasingly calling for better health and safety measures and better fume extraction. 

 
Francisco Partners to acquire Universal Instruments

Universal will continue to operate under its current management team, with a focused business strategy to continue to develop, manufacture, and market its strong portfolio of products and services globally.

 
Ovation Products hires sales manager for Asia

Mr. H. Baba is responsible for introducing Grid-Lok to Asian customers and offering the product to OEMs and FA manufacturers.  

 
Hesse & Knipps’ success in the Americas spurs growth

Johnny Delmont joins company as technical sales manager - the Americas. 

 
Francisco Partners to acquire Hover-Davis, Vitronics Soltec & Universal Instruments

Terms of the transaction were not disclosed and are subject to normal closing conditions and regulatory approvals.

 
VJ Electronix’s Al Cabral to present during Assembly Technology Expo 2006

VJ Electronix announces that Al Cabral will present during the Lead-Free Rework Basics session of the SMTA International Conference, scheduled to take place at the Assembly Technology Expo in Rosemont (Chicago), IL. 

 
IPC releases new book-to-bill ratios & IMS/PCB business report for July 06

“The book-to-bill ratio in both segments of the industry is holding steady at just above parity,” said IPC president Denny McGuirk.  “This suggests that sales will continue to grow modestly during the next few months." 

 
Assembléon introduces integrated functionality on single pick & place platform
With production flexibility now paramount for electronics manufacturers, Assembléon’s next generation A-Series offers a modular solution to achieve the optimal line configuration for all applications. 
 
ABI reduces 2007 RFID market forecast

ABI Research has reduced its 2007 market forecast for RFID software and services revenue to $3.1bn, down 15% from the analyst house’s previous estimates.

 
Francisco Partners agrees to acquire Vitronics Soltec

Vitronics Soltec will continue operation under its current management team and focused business strategy.

 
KIC releases improved software version for KIC 24/7

KIC announces the availability of version 2.3.0.0 of its award winning KIC 24/7 thermal process monitoring system.   

 
BP Microsystems changes its name to BPM Microsystems

The name change became effective August 28, 2006, and coincided with the opening of BPM Microsystems’ new headquarters building in Houston, Texas.

 
Kester presents at IPCWorks 2006

Kester announces that Peter Biocca will present at IPCWorks 2006, scheduled to take place September 10 to 14, 2006, at the American Airlines Training and Conference Center in Fort Worth, Texas.

 
European Semiconductor Distribution Market (DMASS) continues double digit trend

With a sales growth of almost 20%, the 2nd quarter of 2006 has been another positive surprise for the European semiconductor distribution market. Germany (regional) and Standard Analog (product-wise) took again the lead. 

 
Isola reports dramatic growth for lead-free capable laminates

Isola has seen long term growth trends for our high reliability, lead free capable laminates of greater than 40 percent quarter over quarter, for 2005 and 2006 year-to-date.

 
IPC publishes updated World PCB Production and Laminate market report

Highlights of the report include regional summaries of PCB production covering Asia, Europe, the Middle East and Africa, and the Americas; commentary on flexible printed circuits; data on foreign investment in China and overseas investment by U.S. companies; and historical data on world rigid PCB production.

 
DENSO announces new green procurement guidelines for suppliers

The new guidelines expand DENSO’s targets to all suppliers, including equipment, construction, and distribution suppliers. 

 
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Negocios Globales

La recuperación secuencial sigue pero las escaseces de componentes para 2010 permanece “en la pista”

Basado sobre datos MUY preliminares, las ventas de equipo electrónico mundiales crecieron secuencialmente para el tercer cuarto, pero eran todavía a la baja del 8 % en 3Q del 09’contra 3Q’ del 08’ (Carta 1).

 

Blogs de la Industria

Mantente al dia con lo que sucede en la industria. Visita los blogs relacionados a la industra escojidos por el equipo de Global SMT (Blogs son en inglés)

Detalles Sin Plomo

Criterios de inspección ópticos en uniones BGA

El examen visual de la serie de esferas (BGA) uniones de soldadura es mejor conseguido usando un sistema enderscope, disponible de varios proveedores por todo el mundo.

 

Detalles Pequeños

Manejo Termal Parte 2

El mes pasado se abrió esta discusión del manejo termal, proporcionando el fondo en cuanto a la importancia de la dirección termal afirmada en el aumento de densidad de transistor, y la subida de frecuencias en capacitores que se combinan para aumentar densidades de energía termales en el IC.

 

Entrevista del Dia

Entrevista - Scott Fillebrown de ACD y Bob Black de JUKI

Para esta entrevista yo tenía la única oportunidad  de hablar tanto con Scott Fillebrown, el presidente y CEO de ACD, y con el presidente y CEO de Sistemas de Automatización Juki Bob Black sobre este nuevo desarrollo emocionante.

 

Ultima Hora

ICI adquiere Advanced Applied Adhesives

ICI ha anunciado la adquisición de “Advanced Applied Adhesives” (AAA), un negocio de materiales electrónicos basado en San Diego , California , para añadir al grupo Materiales Electrónicos (EM por sus siglas an inglés). Los términos de la transacción no fueron divulgados. Lea mas...