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escrito por Global SMT & Packaging
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EF-6100 is the latest addition to its steadily expanding line of lead-free-friendly fluxes. |
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escrito por Global SMT & Packaging
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ViTechnology's Vi-1K brings affordable, high-performance bench-top inspection to high-mix, low-volume manufacturing. |
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escrito por Global SMT & Packaging
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As part of its commitment to more effective solutions in yield improvement, the Christopher Group has introduced the DaiNippon Screen FP 8000 final visual inspection system.
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escrito por Global SMT & Packaging
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The laboratory located at AIM’s corporate headquarters has successfully passed the ISO 17025 accreditation. |
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escrito por Global SMT & Packaging
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RVSI Inspection ships its new Package Visual Inspection (PVI) platform. |
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escrito por Walt & Jon Custer
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Globally, 2005 was a decent year, driven by consumer devices (cell phones, personal computers and new video games) plus a rebound in the telecom/datacom sector....
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escrito por Alan Rae
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Roadmaps are a really good tool for pacing the evolution of a well-developed technology into the future and identifying gaps and challenges to its future development. |
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escrito por Dongkai Shangguan
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As we put more lead-free electronics products on the market, the issue of reliability is up-most on many people’s minds. |
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escrito por Joe Fjlestad
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Since shortly after the introduction of the first ICs there has been an effort to put in place standards for IC packages. |
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escrito por Global SMT & Packaging
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 Featuring outstanding configuration flexibility, multiple x-ray source options, and 6 axes of motion control. |
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escrito por Global SMT & Packaging
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By using exclusively licensed, patent-protected techniques developed in conjunction with Novatec, Europlacer’s feeders enable reliable assembly of solder balls as part of the standard surface mount pick-and-place process.
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escrito por Clive Ashmore
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 Many words have been written about the impending lead-free transition. During this period of frantic discovery, much has been communicated about reflow and alloy concerns, but the print process, which, let’s face it, is the first process that adds value, is often overlooked.
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escrito por Joe Belmonte & Srinivasa Aravamudhan
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 The 01005-chip component package, ranging from 0.10 x 0.304mm (0.004” x 0.012”) to 0.20 x 0.40mm (0.008” x 0.016”) depending on the supplier and if the 01005 component is a resistor or a capacitor, is dramatically smaller than the previous smallest component package used for resistors and capacitors, the 0201 (0.60 x 0.30mm (0.0236” x 0.0118”) component package.
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escrito por Peter Biocca
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 Another year has begun, and with the impending July 1st 2006 deadline for the RoHS Directive rapidly approaching, some companies are experiencing the stresses involved in meeting their obligations.
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escrito por Trevor Galbraith
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Kyzen Corporation is universally acknowledged as the leading supplier of cleaning chemistry in the United States.
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escrito por Global SMT & Packaging
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Issue 6.2 / February 2006
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"Understanding stencil requirements for a lead-free mass imaging process" by Clive Ashmore
- The turtle and the hare - beating the RoHS deadline anyway" by Peter Biocca
- "Developing the 01005 stencil printing process" by Joe Belemonte
- Technology focus: Surface mount solder ball assembly
...and more. Click for full table of contents. |
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escrito por Global SMT & Packaging
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The latest version of the PRO 1T selective soldering work cell uses a top-side iron tip with automatic solder feeder. |
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escrito por Trevor Galbraith
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JUKI boasts one of the largest installed bases of pick-and-place equipment in the world, with more than 15,000 machines in operation.
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escrito por Walt & Jon Custer
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As we enter 2006, business conditions remain ‘better’ than previously expected, no doubt benefiting from an overflow of work from full Asian factories....
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escrito por Bob Willis
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As industry changes to meet the deadline of July 2006, components, materials, printed boards and service industries that support you will also change the product and services they supply. |
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escrito por Joe Fjlestad
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As one reads the articles and literature on micro electromechanical systems or MEMS, as it is more commonly known, one might get the impression that it is a new technology. |
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escrito por Werner Engelmaier
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Voids in SJs have received more attention then they deserve. One reason might be that you can easily see them with X-ray. The micro-voids that you cannot see easily may be more of a problem. |
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escrito por Dongkai Shangguan
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In this column a year ago, I stated that “the transition to lead-free soldering is taking place worldwide, and the train has left the station.” |
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escrito por Ray Cirimele
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 Can lead-free solder joints be completed using a soldering iron and tip that were previously used for tin/lead soldering?
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escrito por Parminder Singh
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 As demand for lighter and more compact products in the field of mobile phones, PDAs and other devices continues, use of 01005 components--at 50% the weight and one quarter the area of 0201 components--will grow in coming years.
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escrito por Steve Stach & Mike Bixenman
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 In Global SMT & Packaging issue 5.6 (June/July 2005), Stach & Bixenman presented research for optimizing cleaning energy in batch and inline cleaning systems....
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escrito por Global SMT & Packaging
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Issue 6.1 / January 2006
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"Contamination control in lead-free hand soldering"
by Ray Cirimele
- "Optimizing cleaning energy with spray in air systems - pt 2" by Steve Stach, Mike Bixenman
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"Challenges in 01005 placement" by Parminder Singh
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"Cross cultural selling, think global, act local" by Steve Thurlow
...and more. Click for full table of contents. |
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escrito por Global SMT & Packaging
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Attention: Registration is now open for the 2006 Global Technology Awards. The closing date for entries is July 14, 2006. More information.
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