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escrito por Global SMT & Packaging
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Copies will be available in time for the 2007 IPC Printed Circuits Expo®, APEX ®and the Designers Summit in Los Angeles, California taking place February 17-22. |
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escrito por Global SMT & Packaging
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IPC Executive Market and Technology Forum Conference will be held in Brussel, Belgium, 29-30 November 2006. |
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escrito por Global SMT & Packaging
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Overwhelmingly, both OEMs and EMS companies indicated reliability
concerns, component acquisition and labeling, and inventory management
as the greatest hindrances to lead free implementation.
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escrito por Global SMT & Packaging
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To be held Thursday 26th October 2006 at the Deer Park Golf and Country Club, Livingston, Scotland. |
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escrito por Global SMT & Packaging
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During the annual meeting at SMTA International on Wednesday, September 29th, the association honored members who have shown exceptional service to the association and the industry. |
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escrito por Global SMT & Packaging
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David Raby explains the decision to move SMTAI to Orlando in 2007. |
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escrito por Global SMT & Packaging
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IPC announces the publication of two major industry reports: "Worldwide High Speed Electronics Technology and Market Trends for the
Years 2006-2016” and “Medical Electronics Market Opportunities for
Interconnect Manufacturers”
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escrito por Global SMT & Packaging
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All three studies are available to IPC members and nonmembers. |
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escrito por Global SMT & Packaging
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The 4th annual Medical Electronics Symposium will be held May 1-3, 2007 at the Sheraton Hotel in Bloomington, MN, USA. Deadline for abstracts is December 1, 2006. |
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escrito por Global SMT & Packaging
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IPC - Association Connecting Electronics Industries® welcomes Dr. Buzz Aldrin, Walt Custer and iNEMI representatives as keynote speakers at IPC Printed Circuits Expo®, APEX® and Designers Summit, February 20-22, 2007 at the Los Angeles Convention Center, Los Angeles, Calif. |
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escrito por Global SMT & Packaging
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Four half-day workshops will be offered on November 1 at the International Wafer-Level Packaging Conference (IWLPC). |
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escrito por Global SMT & Packaging
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SMART Group will hold a special seminar, question time and table-top exhibition on November 7th at Wycombe FC Conference Centre. |
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escrito por Global SMT & Packaging
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IPC's OEM Critical Components Committee hopes to release the standard by the second quarter of 2007. |
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escrito por Global SMT & Packaging
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Submissions must be received by November 15, 2006.
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escrito por Global SMT & Packaging
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New to the award category this year was the presentation of committee leadership awards.
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escrito por Global SMT & Packaging
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The IMAPS EMPC is Europe’s premier conference related to microelectronic packaging and interconnection technologies. The EMPC conference, which takes place June 17-20, 2007, addresses "everything in electronics between the chip and the system." |
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escrito por Global SMT & Packaging
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Starting September 15, exhibitors will have one more tool to assist them in getting the most out of the exhibition and having the greatest possible success in attracting the attention of qualified attendees |
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escrito por Global SMT & Packaging
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iNEMI and IPC sponsor event to discuss emerging environmental regulations. |
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escrito por Global SMT & Packaging
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Workshop to be held Wednesday, 11 October 2006 at the Oxfordshire conference center in Thame. |
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escrito por Global SMT & Packaging
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Partnering with CircuiTree and EMSNow, EIPC will bring global OEM, ODM,
EMS, PCB makers and industry suppliers together in Koelnmesse, Cologne,
Germany, October 4th & 5th.
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escrito por Global SMT & Packaging
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The IWLPC, co-presented by Chip Scale Review and the SMTA, will take
place from November 1-3, 2006, at the Wyndham Hotel, San Jose.
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escrito por Global SMT & Packaging
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September 17 - 20, 2006 at the Elite Park Hotel, Gothenburg |
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escrito por Global SMT & Packaging
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While traditionally this level of incentive negotiation was conducted
for only the largest manufacturers, all members of IPC will now have
access to the services offered by LMS at no upfront cost.
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escrito por Global SMT & Packaging
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Highlights of the report include regional summaries of PCB production
covering Asia, Europe, the Middle East and Africa, and the Americas;
commentary on flexible printed circuits; data on foreign investment in
China and overseas investment by U.S. companies; and historical data on
world rigid PCB production.
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escrito por Global SMT & Packaging
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SMART Group to hold four-module workshop 7th September at Soldertec's research faciilities, St. Albans, UK. |
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escrito por Global SMT & Packaging
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Dr. Jacob’s speech will be in conjunction with the RF and Wireless Day at the Symposium – Tuesday, October 10, 2006. |
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escrito por Global SMT & Packaging
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IPC will hold a technical summit meeting in mid-September in San Jose, Calif. to begin development of standards for the manufacture of lithium ion batteries for portable and handheld electronics. |
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escrito por Global SMT & Packaging
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IPC/JEDEC International Conferences on Lead Free Electronic Components and Assemblies |
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escrito por Global SMT & Packaging
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SMART Group announces three autumn events, two in Thame and one in Wycombe, UK. |
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escrito por Global SMT & Packaging
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Dr. Jacob’s speech will be in conjunction with the RF and Wireless Day at the Symposium on Tuesday, October 10, 2006. |
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