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IPC history book nears completion Imprimir E-Mail
escrito por Global SMT & Packaging   
Copies will be available in time for the 2007 IPC Printed Circuits Expo®, APEX ®and the Designers Summit in Los Angeles, California taking place February 17-22.
 
Smaller, faster, better, cheaper: Trends in electronics manufacturing Imprimir E-Mail
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IPC Executive Market and Technology Forum Conference will be held in Brussel, Belgium, 29-30 November 2006.

 
IPC lead free study indicates industry dissatisfaction with component manufacturers Imprimir E-Mail
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Overwhelmingly, both OEMs and EMS companies indicated reliability concerns, component acquisition and labeling, and inventory management as the greatest hindrances to lead free implementation.

 
After RoHS . . . Workshop & Table-Top Exhibition Imprimir E-Mail
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To be held Thursday 26th October 2006 at the Deer Park Golf and Country Club, Livingston, Scotland. 

 
SMTA annual awards announced Imprimir E-Mail
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During the annual meeting at SMTA International on Wednesday, September 29th, the association honored members who have shown exceptional service to the association and the industry. 

 
Message from SMTA President David Raby on SMTAI 2007 - why Orlando? Imprimir E-Mail
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David Raby explains the decision to move SMTAI to Orlando in 2007.

 
IPC publishes two industry studies on high speed and medical electronics market opportunities Imprimir E-Mail
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IPC announces the publication of two major industry reports: "Worldwide High Speed Electronics Technology and Market Trends for the Years 2006-2016” and “Medical Electronics Market Opportunities for Interconnect Manufacturers”

 
IPC issues annual PCB studies Imprimir E-Mail
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All three studies are available to IPC members and nonmembers.

 
Medical Electronics Symposium - Call for papers Imprimir E-Mail
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The 4th annual Medical Electronics Symposium will be held May 1-3, 2007 at the Sheraton Hotel in Bloomington, MN, USA. Deadline for abstracts is December 1, 2006.

 
Buzz Aldrin, others look into the future at 2007 IPC Printed Circuits Expo/APEX/Designers Summit Imprimir E-Mail
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IPC - Association Connecting Electronics Industries® welcomes Dr. Buzz Aldrin, Walt Custer and iNEMI representatives as keynote speakers at IPC Printed Circuits Expo®, APEX® and Designers Summit, February 20-22, 2007 at the Los Angeles Convention Center, Los Angeles, Calif.  

 
IWLPC workshops by experts cover timely semiconductor packaging topics Imprimir E-Mail
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Four half-day workshops will be offered on November 1 at the International Wafer-Level Packaging Conference (IWLPC). 

 
SMART Group special event Imprimir E-Mail
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SMART Group will hold a special seminar, question time and table-top exhibition on November 7th at Wycombe FC Conference Centre. 

 
IPC to begin work on lithium-ion battery cell standard Imprimir E-Mail
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IPC's OEM Critical Components Committee hopes to release the standard by the second quarter of 2007. 

 
Candidates sought for IPC Board of Directors Imprimir E-Mail
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Submissions must be received by November 15, 2006.

 
51 members honored at IPCWorks 2006 Imprimir E-Mail
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New to the award category this year was the presentation of committee leadership awards.

 
16th European Microelectronics and Packaging Conference & Exhibition Imprimir E-Mail
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The IMAPS EMPC is Europe’s premier conference related to microelectronic packaging and interconnection technologies. The EMPC conference, which takes place June 17-20, 2007, addresses "everything in electronics between the chip and the system."

 
Unique partnership with exhibitors takes off to cyberspace Imprimir E-Mail
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Starting September 15, exhibitors will have one more tool to assist them in getting the most out of the exhibition and having the greatest possible success in attracting the attention of qualified attendees 

 
Life after EU RoHS forum scheduled for September 28 Imprimir E-Mail
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iNEMI and IPC sponsor event to discuss emerging environmental regulations. 

 
Practical Lead-Free Rework & Repair Workshop Imprimir E-Mail
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Workshop to be held Wednesday, 11 October 2006 at the Oxfordshire conference center in Thame. 

 
European Supply Chain Convention 2006 Imprimir E-Mail
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Partnering with CircuiTree and EMSNow, EIPC will bring global OEM, ODM, EMS, PCB makers and industry suppliers together in Koelnmesse, Cologne, Germany, October 4th & 5th.

 
IWLPC panel explores business and marketing issues of wafer-level packaging Imprimir E-Mail
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The IWLPC, co-presented by Chip Scale Review and the SMTA, will take place from November 1-3, 2006, at the Wyndham Hotel, San Jose.

 
IMAPS Nordic Conference, Gothenburg, Sweden Imprimir E-Mail
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September 17 - 20, 2006 at the Elite Park Hotel, Gothenburg 

 
IPC Partners with Location Management Services to launch new benefit for members Imprimir E-Mail
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While traditionally this level of incentive negotiation was conducted for only the largest manufacturers, all members of IPC will now have access to the services offered by LMS at no upfront cost.

 
IPC publishes updated World PCB Production and Laminate market report Imprimir E-Mail
escrito por Global SMT & Packaging   

Highlights of the report include regional summaries of PCB production covering Asia, Europe, the Middle East and Africa, and the Americas; commentary on flexible printed circuits; data on foreign investment in China and overseas investment by U.S. companies; and historical data on world rigid PCB production.

 
Workshop: Controlling a Lead Free Proces Imprimir E-Mail
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SMART Group to hold four-module workshop 7th September at Soldertec's research faciilities, St. Albans, UK. 

 
Dr. Irwin Jacobs, Chairman of Qualcomm, Inc. to be keynote speaker at IMAPS 2006 Imprimir E-Mail
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Dr. Jacob’s speech will be in conjunction with the RF and Wireless Day at the Symposium – Tuesday, October 10, 2006.

 
IPC OEM critical components committee to develop standardization for manufacturing lithium ion batte Imprimir E-Mail
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IPC will hold a technical summit meeting in mid-September in San Jose, Calif. to begin development of standards for the manufacture of lithium ion batteries for portable and handheld electronics.

 
Call for participation: Singapore, Frankfort, Boston Imprimir E-Mail
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IPC/JEDEC International Conferences on Lead Free Electronic Components and Assemblies 

 
Upcoming SMART Group events Imprimir E-Mail
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SMART Group announces three autumn events, two in Thame and one in Wycombe, UK. 

 
Dr. Irwin Jacobs, chairman of Qualcomm, Inc. to be keynote speaker at IMAPS 2006 Imprimir E-Mail
escrito por Global SMT & Packaging   

Dr. Jacob’s speech will be in conjunction with the RF and Wireless Day at the Symposium on Tuesday, October 10, 2006. 

 
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