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Data I/O® Corporation announced a new ProLINE-RoadRunner™ in-line programming solution configured sp
New ProLINE-RoadRunner™ in-line programming solution is configured specifically for Siemens X-Series placement machines.
 
New high density interconnect arrays available from Samtec
New Samtec SEARAY™ high density interconnects (SEAM/SEAF series) provide a solid grid of contacts.
 
Low-voiding lead-free solder material from Henkel delivers advantages for fine-pitch
Multicore® LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications.
 
Cyber Technologies introduces new software, color camera
Cyber Technologies introduces several new features to its line of CyberScan Vantage measurement systems.
 
2005 IWLPC best paper announced

As rated by the attendees, the Best of Conference Award at the International Wafer-Level Packaging Conference (IWLPC) held in November 2005 was presented to Peter Salmon, SysFlex, Inc (Mountain View, CA).

 
Digi-Key expands Micron line to include imaging products

Micron Technology’s high-performance imaging products are now available through Digi-Key’s worldwide distribution channel.

 
Cookson Electronics launches high reliability ALPHA EF-6100 low-solids wave solder flux
EF-6100 is the latest addition to its steadily expanding line of lead-free-friendly fluxes.
 
ViTechnology® unveiled bench-top AOI system at APEX 2006
ViTechnology's Vi-1K brings affordable, high-performance bench-top inspection to high-mix, low-volume manufacturing. 
 
Christopher Group announces new automatic final visual inspection system

As part of its commitment to more effective solutions in yield improvement, the Christopher Group has introduced the DaiNippon Screen FP 8000 final visual inspection system.

 
AIM’s laboratory accredited to ISO 17025
The laboratory located at AIM’s corporate headquarters has successfully passed the ISO 17025 accreditation.
 
RVSI Inspection introduces vision system for defect inspection
RVSI Inspection ships its new Package Visual Inspection (PVI) platform.
 
Market Report: 2006 - off & running
Globally, 2005 was a decent year, driven by consumer devices (cell phones, personal computers and new video games) plus a rebound in the telecom/datacom sector....
 
FocalSpot introduces Concept FX, multi-axis high-resolution x-ray inspection
Featuring outstanding configuration flexibility, multiple x-ray source options, and 6 axes of motion control.
 
PROMATION PRO 1Tc dual iron tip system
The latest version of the PRO 1T selective soldering work cell uses a top-side iron tip with automatic solder feeder.
 
Market Report: Surprising early 2006 market strength
As we enter 2006, business conditions remain ‘better’ than previously expected, no doubt benefiting from an overflow of work from full Asian factories....
 
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Ultima Hora

ICI adquiere Advanced Applied Adhesives

ICI ha anunciado la adquisición de “Advanced Applied Adhesives” (AAA), un negocio de materiales electrónicos basado en San Diego , California , para añadir al grupo Materiales Electrónicos (EM por sus siglas an inglés). Los términos de la transacción no fueron divulgados. Lea mas...
 
Global SMT & Packaging China Edition