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Transponder coils for automotive applications
The transponder coils are RoHS-compatible, suitable for lead-free reflow soldering to JEDEC J-STD-020C and can be processed with automatic SMD placement systems.
 
AVX - Lower ESR B-case size capacitor withstands 3 x 260°C reflow
Devices offer 100uF capacitance at 6.3V and are part of the only family of polymer devices on the market capable of withstanding the lead-free requirement for reflow at 3 x 260°C.
 
StratEdge power amplifier package used on Mars Rovers
The poewer amplifer packages, which protect the chips that transmit the signals from the Mars Rover to Earth, have been operating over two years and are still working, although the life of the project was designed for three months.

 

 
I&J Fisnar introduce new micro-dot valves

I&J Fisnar Inc offer a selection of micro-dot dispensing valves for fluids from low to high viscosity.   

 
Samtec introduces new high speed cable assembly guide

Samtec’s full line of standard and unique RF cable assemblies including discrete wire, ganged, and combo assemblies has also been added to the guide, along with AccliMate™ IP68 sealed circular cable systems and high speed flex assemblies and capabilities.

 
Data I/O and ICOS Vision Systems collaborate

Innovative station for programmable ICs combines programming and 3D inspection into one high-speed process

 
Intertonics introduces Flextac BGA stencil rework kit

Disposable Flextac stencils have an adhesive side that attaches temporarily to the PCB, preventing misalignment and solder paste smearing.

 
Real-time video & high res image capture for microprobe station

J microTechnology’s NAT-30 USB camera adds real-time video and high resolution digital image capture to microprobe station.

 
SL101 digital dispenser brings digitally controlled dispensing to all budgets

The SL101 gives the user optimum control and flexibility over the dispensing process.

 
JTAG Technologies delivers 1149.6 testing with diagnostics

Boundary-scan capabilities extended to high-speed digital networks

 
XJTAG Professional development system unveiled at electronica
XJTAG Professional enables design engineers to significantly reduce the time and cost of board development and prototyping.
 
Teradyne expands TestStation scalability with UltraPin II pin board family
New non-multiplexed Analog and Digital pin boards extend TestStation’s scalability from cost effective MDA+ (analog only) applications to high-performance digital in-circuit test (ICT).

 

 
Teradyne announces Debug Pro™ test programming and debug software for TestStation ICTs

Enhanced graphics and simplified, menu-driven programming ensures a simpler, more intuitive interface and easier access to TestStation’s powerful suite of test debug tools.

 
AGI announces titanium selective solder pallet

AGI Corp’s design is based upon machining a single piece of titanium to match the PCB and incorporate that into a composite pallet frame.

 
Industry's first 1.8V ultra lower power, ultra thin SPI serial flash memory family

SST's new SST25WF family features 2 µA standby current and ultra small z-scale package for portable electronic devices.

 
Melexis introduces low-power 300-to-930-MHz RF receiver chip

This new automotive qualified IC with dual RF input has been specifically designed for low cost antenna diversity applications in the unlicensed Industrial-Scientific-Medical (ISM) and Short-Range-Devices (SRD) frequency bands.

 
KIC introduces KIC Vision

Low-cost automatic profiling system eliminates manual verification profiling.

 
Aeroflex first to deliver EvDO Rev. A signalling conformance solution

Fully automated suite of test cases for 6402 CDMA AIME network emulator meets C.S0038-A requirements.

 
New Cookson Electronics’ Plaskon® Colormold™ adds color feature to memory cards

This versatile new compound will allow memory card manufacturers to differentiate their products based on Colormold’s™ range of customer colors, including black, red and blue.

 
SUSS MicroTec and SAES® Getters extend wafer-level packaged MEMS lifetime

SAES’ PaGeWafer® and SUSS’ M-Lock™ support the most demanding vacuum requirements for wafer-level packaging applications.

 
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