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Arguna® 625 & 626: a pair of selective high speed silver processes |
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domingo, 26 de febrero de 2006 |
High speed selective plating equipment needs dedicated plating chemistry and Schloetter offer two processes, with or without free cyanide. The processes are mainly used for the semiconductor industry.
Arguna® 625 offers a semi-bright, pleasing appearance with good bondability and solderability and a 0.3 to 1.0 microns/second plating rate. It does not contain free cyanide and uses only insoluble anodes. Arguna® 626 offers the same semi-bright appearance and good bondability/solderability, but features a 0.2 to 1.5 microns/second plating rate. It contains free cyanide and uses either soluble or insoluble anodes. www.schloetter.co.uk |
