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The European Institute of Printed Circuits (EIPC) is extending an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Winter Conference which is to be held on February 8 & 9 2007 in Salzburg, Austria.
The aim of the Winter Conference is to provide a platform for speakers and delegates to exchange information on market conditions and future innovation on interconnection and packaging. Delegates and visitors from throughout Europe will attend this event, offering presenters the opportunity to reach a targeted audience of decision makers and leaders of the international packaging and interconnection industry.
Salzburg
Salzburg is a happy combination of natural landscapes and architecture, tradition and innovation. The city scene is characterised by baroque churches and palaces, elegant streets with a lot of atmosphere and some beautiful façades. It is not without good reason that Salzburg was added to the UNESCO world cultural heritage list in 1997. The city is proud to offer theatre, concerts and art on a par with the major cities of the world. And it has a lot of places for tourists to visit like Festung Hohensalzburg, the Salzburger Dom and Schloss Mirabel.
Alongside the sensitively renovated old city, contemporary Salzburg is also a modern city. As an administrative centre it also provides services for a whole region. Nor has modern architecture been neglected in Salzburg; recent years have seen the creation of a number of impressive buildings which have brought the city international recognition. Salzburg's old city is famed as being Austria's most attractive shopping centre. And as far as specialist trade-fairs in Austria are concerned, the city of Mozart also enjoys pride of place.
EIPC Winter Conference Salzburg at a glance
The conference will be held on Thursday February 8 and Friday February 9 2007 at the Renaissance Salzburg Hotel. The hotel is located in the new business centre in close vicinity to the main railway station. The various attractions can be reached on foot within a few minutes walk. The hotel is located and easily reachable by motorways (3km – exit Nord-Zentrum) and from the International Airport (8km).
Networking event
At the end of the first conference day, an evening program for all conference delegates will be organised. The program contains a guided city tour as well as a networking dinner. Details about this program and a post conference tour will be announced with the programme.
Topics
We invite you to submit a paper for one of the following key topics:
Management sessions:
• Market developments and forecasting
• Technology developments and trends
• Progress in additive technology
• New PCB requirements and technologies for:
- Automotive application
- Telecom application
- Industrial electronics
• Embedded components status report
Technology Sessions:
Laminate:
• Multilayer technology with advanced laminate and prepreg
• New developments and halogen free materials
Drilling:
• Tools for drilling and routing
• Special technologies to increase tool life
• New developments to increase productivity precision for HDI layer
Prelaminating cleaning:
• What technology will provide reliable surfaces for HDI PCBs
- Chemical cleaning incl. nano technology
- Pumice
- New generation of brushes
Imaging:
• Exposure, development and stripping equipment to meet future challenges
• Dryfilm or liquid resist?
• Pattern plating versus panel plating tent and etch
• LDI Technology
• Soldermask - How to meet future needs in registration and with minimum features?
Plating and etching:
• Equipment developments
• Process improvements
Final solderable surfaces for PCBs:
• New developments using nano technology
• Comparisons and experience report
Environmental:
• Experience report on moving to halogen free laminate and RoHS compatible (e.g. lead free) PCB assemblies
• Declaration of “ECO label” products
• Environmental testing to meet legal requirements for product safety
Registration enquiries
Please send registration enquiries to Kirsten Smit-Westenberg, Conference Organiser. Email: kwestenberg@eipc.org Tel +31-(0) 43-3440872
Early Registration Offers
Register before December 20 to take advantage of the special Early Bird Discount registration fee.
Full Conference
€ 575.- EIPC members before December 20 2006
€ 655.- EIPC members after December 20 2006
Full Conference
€ 710.- Non members before December 20 2006
€ 790.- Non members after December 20 2006
Registration includes a copy of the proceedings, meals and refreshments during the day and one ticket for the evening programme on February 8. |
