In many cases, drilling of PCBs and organic chip packages is the most cost intensive individual fabrication process when manufacturing Multilayer PCBs.

An update on latest technology and learn about the cost reduction potential when drilling PCBs, the European Institute of Printed Circuits (EIPC) in conjunction with leading companies in drilling and routing technology have organized a seminar that will help to develop and train the participants about the full cost reduction potential that is available in the drilling and routing fabrication processes of PCBs.

The seminar concentrates on throughput and yield improvements as well as how to optimize the use of consumables and how to minimize set up time during the PCB fabrication process.

Attending the seminar is a MUST for quality managers, engineers and specialist that are responsible for optimizing production throughput, quality at lowest possible cost.  The seminar will help to fully develop the cost reduction potential when drilling advanced PCBs as well as organic chip packages.

The Seminar will run over 2 days, November 28th and 29th, with the presentations in German on the 28th, and in English on the 29th.

It will cover advanced small hole drilling for PCBs and Chip Packages, guidance on optimum processing, productivity and drilling accuracy.

For more information regarding this event please contact Sonja Derhaag sderhaag@eipc.org or call 0031-43-3440872.