|
The objective of this Advanced Technology Workshop (ATW) is to have a unique technical forum that brings scientists, engineers and academia who have been working in the area of advanced electronic package reliability and electronic device reliability in extreme cold temperature environments. The technical forum is intended to include professionals from academia, industrial electronic package and device community, automobile industrial community, federal laboratories, space agencies around the globe, etc.
The topics for this workshop especially under extreme cold temperatures include, but are not limited to:
Overview of the reliability of electronics, quality assurance, reliability, testing, and characterization
Advanced electronic devices based on silicon, gallium arsenide, etc.
FPGAs, FPAAs, DSPs for extreme environments
A to D converters and D to A converters
Reconfigurable electronics for extreme temperatures
Discrete passives and actives
Embedded passives and actives
Plastic encapsulated microcircuits (PEMS)
Metallic contacts
Advanced electronic packages that cover area array packages, ball grid arrays, chip scale packages, flip chip technologies, etc.
Software tools to assess the advanced packages
Reliability of Microsystems, MEMS, sensors, CCDs, etc
Physics of failure and models
Electrostatic discharge effects
Power sources such as primary batteries, rechargeable batteries, and solar cells
Reliability of various solders (conventional solders and lead free solders).
Growth of Tin whiskers and the reliability issues
Effect of workmanship and the processes on the reliability
Polymers, polymeric bonding, adhesion issues and reliability
Thermal protection systems reliability
Carbon-carbon composite reliability
Reliability of thermal control hardware (platinum resistance thermometry, PRT), Louvers, Heaters, Thermostats, Heat pipes, microchannels, etc. Life testing of electronic devices and electronic packages including HALT and HASS
Advanced inspection techniques
Non-destructive evaluation tools
Design of experiments
Standardization issues and needs of such technologies
Qualification of electronic packages for deep space missions
Optoelectronic components and optoelectronic package reliability
Dynamic (shock and vibration) testing of hardware in conjunction with cold environments
Effect of aging
Life cycle predictability, inspection, analysis, verification and validation
Reliability via thermal cycling under extreme cold environments, package qualification and verification
Conformal coatings and materials
Thermal management reliability issues
Materials properties
Highly accelerated life testing under extreme low temperatures
Packaging for low temperature applications
To submit an abstract:
Please send your 200 word abstract describing your 25 minute presentation electronically no later than November 30, 2006, using the on-line submittal form at: http://www.imaps.org/abstracts.htm.
No formal technical papers are published for these forums to encourage presentation of current development activities. A reproduction-ready two-to-six-page concise summary with text (figures and graphs included if necessary) or 20-30 viewgraphs will be due on January 26, 2007 for the abstract booklet that will be distributed to attendees only.
IMAPS will also be producing a CD-ROM of presentations after the event. All speakers are asked to email a PDF copy of his/her presentation to Brian Schieman (bschieman@imaps.org) prior to the event, if possible; or hand in an electronic PDF copy of your presentation to the staff representative at the IMAPS registration desk on the morning of your presentation. CD-ROM of presentations will be mailed 10 business days after the event.
If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.
Speakers are required to pay a reduced registration fee.
All authors are requested to attend the entire Workshop to maximize opportunities for interaction with registered attendees. This IMAPS Workshop format is a proven forum for effective industry networking.
February 27 – March 1, 2007
Embassy Suites Hotel Arcadia – Pasadena Area
211 East Huntington Drive
Arcadia, California - USA
General chair:
Dr. Rajeshuni Ramesham
Jet Propulsion Laboratory, California Institute of Technology
Phone: 818-354-7190, Fax: 818-393-4382
E-mail: Rajeshuni.Ramesham@jpl.nasa.gov
http://www.imaps.org/extremecold |
