IMAPS is pleased to organize the 3rd International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The 3rd International Device Packaging Conference and Exhibition will be held March 19 - 22, 2007, in Scottsdale, AZ. An exhibition and technology showcase will be held March 20 & 21.

The format again this year will feature six Workshops concentrating on:

• 3D packaging
• Copper/low-K
• Flip chip/WLCSP
• Biomedical
• MEMS
• Optoeletronics

These workshops are a continuation of past successful IMAPS Advanced Technology Workshops. This format will provide a forum for the presentations of leading edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging.

Device Packaging 2007 will also feature one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available.

There will be several professional development and networking opportunities at Device Packaging 2007. For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on the Monday afternoon, March 19th, preceding the technical conference. The Global Business Council (GBC) will be offering a stellar Spring Conference focusing on the business side of these technologies held in conjunction with Device Packaging. There will also be several networking receptions and gatherings including the opening receptions, meals and other social events.

Those wishing to present a paper at the Device Packaging Conference, please submit a 250-300 word abstract electronically by December 15, 2006, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

No formal technical paper is required. A reproduction-ready two- to six-page extended abstract with text (figures and graphs included if necessary) will be required for the abstract booklet on February 9, 2007. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee. www.imaps.com/devicepackaging/