|
Speakers at the International Wafer-Level Packaging Conference (IWLPC) that was held November 1-3, 2006, at the Wyndham Hotel - San Jose (CA), addressed issues in semiconductor packaging, chip scale packaging, 3D, system-in-package, system-on-chip, system-on-package, and wafer-level packaging.
As rated by the attendees, the Best of Conference Award was presented to Giles Humpston of Tessera, Inc. The paper was co-authored by Michael Nystrom of Tessera Inc., and Senthil Kanagavel, Michael Previti, and Mark Wilson of Cookson Electronics Inc. In their paper, entitled “Utilization of Die Attach Adhesives in Wafer Level Assembly of Cavity Packages for Image Sensors,“ the authors describe the materials attributes required of the adhesive and demonstrate how film and screen-print die attach adhesives can be adapted and used outside of their normal process bounds to achieve joints of satisfactory quality for this application.
The Best of Conference paper is featured in the 2006 IWLPC Proceedings, available in the SMTA Bookstore at http://www.smta.org/store/book_detail.cfm?BOOK_ID=283.
The fourth annual IWLPC has been scheduled for September 17-19, 2007, in San Jose, CA. For developing information visit the event Web site at smta.org/iwlpc or contact SMTA educational programs coordinator Melissa Serres at 952-920-7682 or melissa@smta.org.
http://www.smta.org/iwlpc/ |
