Hard on the heels of the successful and informative 2006 European BTW (EBTW), held in Southampton, UK comes the call for papers for the 2007 event, which is headed for Germany for the first time.

Scheduled for May 24th and 25th 2007 the EBTW event will be held in association with the 2007 European Test Symposium in Frieburg, Germany, close to the Basle on the Swiss and French borders. The event is focused on current issues and trends related to board (pcb) and system test. In common with earlier EBTWs, perspectives are invited from contract manufacturers, test equipment providers, researchers, end-users and systems providers.

Technical papers are invited on a variety of topics from the following lists and a full schedule of events will be presented on the EBTW web-site which can be found at www.molesystems.com/EBTW07 .

Key dates for submissions and review are as follows:

Submission of full papers or extended abstracts: 25th  February, 2007

Notification of acceptance:  15th  April, 2007

Final paper due: 13th  May, 2007

Submissions should be made in the first instance to EBTW General Chair Mr Jim Webster at jwebster@integellus.co.uk, or Bill Eklow, Program Chair via beklow@cisco.com.

You may also register for this event now on the web-site with early booking discounts available and reductions for IEEE members.

Papers may be submitted on the following topics or other relevant industry areas:

Traditional Board Test Techniques

• Boundary Scan-based test techniques
• Assessing BSDL compliance and accuracy
• Board test: structural versus functional test
• Parametric testing
• On-Board Built-In Self Test techniques
• Electrical, Optical and X-Ray board test mix
• Board test for high-volume consumer products
• Advances in flying probe technology
• Creating board functional tests
• Advances in ICT fixturing
• Interfacing test flows with manufacturing flows
• Board test: linking ICT with low-cost PC testers
• Board test: fault-coverage metrics
• Board test: reducing false fails
• Applications of VXI/PXI plug ‘n play technology

System-Level and Field-Service Test

• Using 1149.1 as a backplane test-bus
• 1149.1 backplane test-bus support devices
• Systems design integration and test issues
• Field servicing: test needs and solutions

New Standards and New Problems

• Practical use of P1581
• Advances in 1149.6 AC-EXTEST
• Advances in 1149.4 Mixed-Signal test Bus
• Test techniques for SERDES boards
• At-speed board and system structural test

Outsourcing to EMS companies

• Outsourcing to EMSs – issues and solutions
• Re-using prototype tests in volume manufacturing

In-System Configuration

• OnBoard programmability of CPLDs/FPGAs
• How to program PLDs to execute test functions

Board and System Test Economics

• Board test economics
• Emulation in a field-service environment

EBTW07 is sponsored by the IEEE Computer Society - Test Technology Technical Council (TTTC) and supported by the IEEE Board Test Technology Activities Committee (BTTAC). Industry sponsors include JTAG Technologies, Firecron, Goepel, Asset Intertech and International Test Technologies.  www.molesystems.com/EBTW07