SHELLCASE RT is Tessera's next-generation wafer-level, chip-size packaging technology for image sensors and other optical devices. The platform provides key new benefits, including reduced thickness, high yield, and superior reliability. These benefits translate into products such as ultra thin cellular phones or automotive electronics that integrate multiple cameras.

Earlier this year, Tessera introduced SHELLCASE(R) CF, a wire bond technology compatible with standard chip-on-board assembly that provides double-digit yield improvements over existing alternatives in the marketplace. The combination of SHELLCASE CF and our next-generation SHELLCASE RT provides our customers a highly advanced technology portfolio developed to meet the more rigorous requirements of imaging in electronics today. www.tessera.com