The ZESTRON® Resin Test visually identifies the local distribution of resin-based residues on electronic assemblies via a color reaction. According to J-Standard 001D for electronic assemblies class 3, only a resin content of 40µg/cm2 is allowed (equivalent to the amount of resin residues on one solder joint). These resin residues can cause poor adhesion of conformal coatings as well as delamination effects.

The ZESTRON® Resin Test is available as a complete solution in a case, so that it can be used for on-site sampling inspection during SMT-production.

By combining the ZESTRON® Resin Test and the ZESTRON® Flux Test (detects activator residues), a simple and cost effective analytical package is available, which offers the possibility to quickly analyze all coating-relevant residues on assemblies. www.zestron.com