Recently BEST has developed and perfected a reballing technique for area array devices that is designed for speed and fast turn-around of small quantities.

The tooling is designed and fabricated at BEST. The stencils are custom made for your device patterns using the BEST laser.

After applying flux to the bottom of the part, a polyimide stencil corresponding to the size of the balls and part pads is aligned over the part. The properly sized solder balls are then poured into the apertures with the fixture keeping the StencilQuik(TM) stencil affixed to and aligned with the part. The assembly is then reflowed, cleaned and inspected.

This technique is one that is straightforward and is used when a moderate number of the same part pattern reballing is required. The tooling and stenciling is designed for multiple reball cycles. www.solder.net