The OPTO-BONDER® FEMTO is the newest bonder in the award-winning FINEPLACER® family, capable of handling various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass, as well as simple die attach.

The system marks a breakthrough by combining high accuracy (+/-0.5 micron) and process flexibility in arguably the smallest footprint (1270 x 900 mm) for such sophisticated technologies.

New features include a 25 percent larger table, motorized X, Y, Z and theta movements, maximum die size up to 4” diameter, and substrate size up to 6” diameter with automatic pattern recognition.  Bonding processes are automatically controlled, requiring no operator intervention during the alignment and bonding procedure.

The OPTO-BONDER® FEMTO is designed to keep the cost of ownership low, designed for both the production environment and process/product development.

Offering innovative equipment solutions for advanced packaging and rework, FINETECH will display this new platform in booth 418 at the upcoming Photonics West 2007 exhibition, scheduled to take place, January 23-25, 2007, in San Jose, California.

More information is available at www.opto-bonder.com.