Advanced Interconnections Corp. is now offering its new hybrid socket adapter design, which utilizes both male and female pins in an interstitial pattern, in 0.65mm pitch BGA and LGA footprints.

The patented design features the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, with no external hold-downs required, this innovative system is designed for development and validation of BGA and LGA devices, production level socketing, and SMT board-to-board connector applications.

The new hybrid socket adapter design offers very low signal attenuation up to 3.5 GHz, and features standard eutectic tin/lead solder balls or new lead-free tin/silver/copper solder ball terminals for RoHS compliant applications.  Unique alignment pins protect the pin field and aid in hand placement with optional stand-offs available.  A data sheet and signal integrity simulation data and models are available online at www.bgasockets.com. Consult factory for pricing and lead time which vary based on number of positions and options selected.