DEK’s Cyclone precision cleaning technology enables the fast and thorough cleaning of advanced stencils – cutting total cleaning time to under half that required by conventional cleaning systems and delivering rapid cassette-based paper changeover in less than 20 seconds.  Cyclone’s speed and resource efficiency deliver advanced stencil cleaning that maximizes pre-placement yield and uptime.  Unlike traditional cleaning methods, Cyclone provides bi-directional active cleaning whereby a lateral oscillating action occurs simultaneously with traverse.  The technology’s five stage cleaning head provides a progressive and thorough stencil cleaning, with a single wet oscillating stroke combining with the five leading edges to dislodge and remove remaining solder paste residue from the stencil apertures.  This procedure is followed by a return high-flow vacuum stroke using all 4 vacuum vents.  Cyclone’s multiple action cleaning process completely eliminates the need for a conventional third pass, further enhancing productivity and throughput. www.dek.com