Emerson & Cuming introduces a new, jet dispensable solution in underfill technology, XE-1218. This product is a snap cure, ultra fast flow, and reworkable epoxy. XE-1218 is a innovative reworkable capillary flow underfill for chip scale packages (CSP) and ball grid arrays (BGA) devices. The XE-1218 will improve the attachment strength of CSP and BGA assemblies during thermal and mechanical shock, such as drop or bend testing and has excellent thermal reliability. It is designed for high volume assembly operations using syringe or jet dispensing that requires an underfill that flows ultra fast and snap cures in-line. The XE-1218 is specially formulated to allow easy rework of components after underfill cure. This material has a viscosity of 1,400 centipoises and a work time of up to 10 days at room temperature. It cures as fast as 4 minutes at 110°C and even faster at high temperatures.

Emerson & Cuming also introduce the latest solution in electrically conductive pastes, CE-3520-3.  This product is a one component, nickel filled, low stress, low temperature curing electrically conductive adhesive.  It is a modified epoxy combing the strength of epoxy and the flexibility of a silicone.  CE-3520-3 is ideally suited for mismatched TCE applications such as substrate attach and heat sink bonding.  It has good high temperature characteristics, being useful up to 150°C.  The CE-3520-3 is designed for syringe dispensing applications.  It can be cured as fast as 30 minutes at 150°C.  The CE-3520-3 is nickel filled, this gives it a volume resistivity of 2.0 x10-1 ohm-cm but relative cost is less compared to other silver filled epoxies. In addition, the material has a work life of 3 days at 25°C.  www.emersoncuming.com