Speedline Technologies, Inc. will take a leading role at the APEX 2007 Technical Conference, presenting seven papers.  According to Keith Favre, Speedline’s vice president of marketing and business development, “With our substantial internal technical resources and our valued relationships with leading academic institutions and business colleagues, we are pleased to continue a long-standing commitment to develop and publish best practices for SMT manufacturing processes.” 

Presentations include:

Establishing Stencil Design Parameters for 01005 and 0201 Passives and 0.4mm CSPs by Joe Belmonte, Dr. Rita Mohanty, Vatsal Shah, Speedline Technologies; Tim Jensen, Dr. Ron Lasky, Indium Corporation.

Flux Application for Lead-Free Wavesoldering by Kenneth Kirby, Speedline Technologies.

Process Development and Characterization of Stencil Printing Process for Small Stencil Apertures by Srinivasa R. Aravamudhan, Intel Corporation; Dr. Daryl Santos, SUNY Binghamton, NY; Dr. Rita Mohanty, Speedline Technologies.

Hybrid Drying Technology for Inline Aqueous Cleaning of Lead-free Assemblies by Dirk Ellis, Speedline Technologies.

Reflow Process Control Monitoring and Datalogging by Dr. Rita Mohanty, Marc Apell, Tad Formella, Richard Burke, Speedline Technologies.

Tin Corrosion and Lead-free Wave Soldering, by Dr. Matthew J. O’Keefe, Dr. Martin Perez, University of Missouri; Jim Morris, Speedline Technologies.

Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste by Joe Belmonte, Vatsal Shah, Dr. Rita Mohanty, Speedline Technologies; Tim Jensen, Dr. Ron Lasky, Indium Corporation. 

Further detail can be obtained at the Speedline Technologies booth, #1853, and information will be available after the show at www.speedlinetechnologies.com.