The International Electronics Manufacturing Initiative (iNEMI) will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packaging and Manufacturing Technology Society (CPMT), and the 56th Electronic Components and Technology Conference (ECTC). 

The workshop is scheduled for May 30, 2006, at ECTC in San Diego, Calif., and will provide participants an update on recent activities in both the testing and modeling of tin whiskers. In addition, a roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” 

The goal of the workshop is to help industry identify strategies to help assure that long lifecycle applications will not be subject to tin whisker failures. http://www.inemi.org/cms/calendar/06_ECTC_TW_Workshop.html