The SMT Vision Award 2005 has announced LPKF Laser & Electronics as the winner for innovation and excellence in products and service, within the Assembly Tools category. The MicroLine 350Ci is a benchmark for modern vision in technology, representing new ideas and practices that achieve brand new capabilities.

By utilizing its unique laser technology the system’s non-contact depaneling avoids damage to small sensitive components. With its innovative features the MicroLine 350Ci will cut arbitrary shapes without any mechanical impact on the circuit, while leaving no residual dust or debris. PCB designers will enjoy the liberty to place components closer to the edge of the board or to utilize more intricate shapes to better fit the form factor of the final product. Laser cutting is significantly more precise than other depaneling methods and works straight from CAD data, minimizing changeover time and cost.

The MicroLine 350Ci addresses current issues around yield loss in PCB assembly, especially depaneling due to high stress and tight tolerance. Through high productivity the superior cutting speed of the MicroLine 350Ci provides better overall productivity than traditional depaneling methods, especially with thinner material. This world-wide unique laser depaneling technology is innovative and unique to the market.