Henkel’s award-winning record continues. Multicore® LF318 lead-free solder paste received the prestigious Electronics Manufacturing Asia Innovation Award in the category of solder materials at the recent Nepcon China exhibition in Shanghai, China. 

Developed to appeal particularly to multinational manufacturers who wish to qualify a single solder paste that offers reliable performance regardless of climactic condition, Multicore LF318 is a lead-free, halide-free, pin-testable paste formulation that delivers a broad process window for both printing and reflow.

Suitable for reflow in air or nitrogen, Multicore LF318 is highly versatile and displays excellent solderability on a wide range of surface finishes, including Ni/Au, immersion Sn, immersion Ag and OSP copper. www.goleadfree.com