JEDEC and the International Electronics Manufacturing Initiative (iNEMI) announced the availability of two documents intended to help manufacturers reduce the risk of tin whiskers in lead-free products. 

JESD201 provides a uniform environmental acceptance testing and reporting methodology for tin whisker susceptibility of tin and tin alloy surface finishes used in the electronics industry.  It is intended to be used with JESD22-A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes” (published May 2005, with a revision released in October 2005).

JP002 provides guidance in understanding the prevalent theories regarding tin whisker formation, the driving force behind tin whisker growth, and mitigation practices used to minimize whiskers. It serves as a source of background information for JESD22A-121and JESD201. 

JESD201, JP002 and JESD22-A121 can be downloaded from the JEDEC website at:
http://www.jedec.org/DOWNLOAD/search/JESD201.pdf
http://www.jedec.org/DOWNLOAD/search/JP002.pdf
http://www.jedec.org/download/search/22a121-01.pdf