As rated by the attendees, the Best of Conference Award at the International Wafer-Level Packaging Conference (IWLPC) held in November 2005 was presented to Peter Salmon, SysFlex, Inc (Mountain View, CA).

In his paper, entitled ‘Repairable 3D Semiconductor Subsystem’, Salmon describes a conceptual design for a stacked 3D electronic subsystem that achieves a miniaturization factor of over 100 compared with current assemblies, yet it can be well-tested, repairable, and adequately cooled.

Salmon's paper is featured in the 2005 IWLPC Proceedings available in the SMTA Bookstore and will soon be on-line in the Knowledge Base at smta.org.  The third annual IWLPC has been scheduled for November 2-3, 2006, at the Wyndham Hotel in San Jose, CA.  Visit www.smta.org/iwlpc for more info.