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IPC/JEDEC global conference to focus on post-July 1 directives and issues Imprimir E-Mail

IPC – Association Connecting Electronics Industries announces an International Conference on Lead Free Electronic Components and Assemblies, RoHS Compliance and Beyond, sponsored by IPC and JEDEC. It will take place August 16-17, 2006, in Montreal, Canada. The conference will focus on EU member state enforcement and supply chain issues, in addition to discussion on lead free technical implementation issues.

Other conference topics will include low temperature solders; process experience; inspection changes; tin whiskers; reliability; and alternatives for other RoHS banned substances such as flame retardants and Cr(6) coatings. As a special feature, companies may showcase environmentally-friendly RoHS compliant products in a tabletop display area.

The workshops, product display and technical conference will be held at the Hyatt Montreal, 1255 Jeanne-Mance, Montreal, Quebec, Canada.

For more information, visit www.ipc.org/LFMontreal.

 

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ICI adquiere Advanced Applied Adhesives

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