MEPTEC, the MicroElectronics Packaging and Test Engineering Council, formally announced it will hold its next Packaging symposium titled "Medical Electronics: Integrating Technologies – Merging the Microelectronic, Bioscience and Medical Industries” on September 21, 2006 at the Arizona State University Campus in Tempe, AZ. 

This First MEPTEC Symposium on Medical Electronics will bring together technical and business professionals from a variety of disciplines and industries dedicated to the advancement and integration of state-of-the-art technology in medical products. As the Medical Electronics Industry continues to show momentum in growth, with strong demand and expectations coming from the consumer, these experts will discuss the many aspects of technology integration required to bring divergent industries together to collaborate effectively to meet these demands.

MEPTEC’s Symposium Advisory Committee has segmented the program into the following focus areas:

•    Industry Overviews
o    Microelectronic, Bioscience and Medical Perspectives
•    Industry Trends and Integration of Technologies
o    Materials, RF Technology, Power Sources and Miniaturization
•    Industry Growth within the Enabling Technologies
o    Semiconductor, Nanotech, Optoelectronic and MEMS
•    Opportunities in Medical Electronic Products
o    Hearing Aids, Pacemakers, Monitors, X-Ray & Others

To register for or learn more about the symposium, please contact Bette Cooper at 650-714-1570 or bcooper@meptec.org or visit MEPTEC at www.meptec.org.