In Global SMT & Packaging issue 5.6 (June/July 2005), Stach & Bixenman presented research for optimizing cleaning energy in batch and inline cleaning systems....

Phase II of this research, presented here, tests the process cleaning rate equation, which equals the static cleaning rate (chemical forces) plus the dynamic cleaning rate (mechanical forces), using spray-in-air cleaning equipment. The baseline for this experiment establishes the solubility rate of the cleaning solution at static conditions to determine the dissolution rate of flux residue at a pre-determined cleaning chemistry concentration and temperature. Once the cleaning rate is known, how will it be improved by applying physical energy to the board surface? The designed experiment will test the effect of energy applied to the board surface by varying pressure at the board surface. The study’s hypothesis infers that a known dissolution rate and a known surface energy configuration allows an equation to calculate cleaning time and distance. 

This article originally appeared in Global SMT & Packaging magazine in two parts, in issues 5.10 - Nov/Dec 2005 and 6.1 - Jan 2006.

Download the first part of the full article (free) in PDF format.

Download the second part of the full article (free) in PDF format.

Steve Stach is the President and CEO of Austin American Technology, which is a leading producer of aqueous cleaning equipment for batch and inline processes. For more information about this study, Steve can be reached via email at: sstach@aat-corp.com

Mike Bixenman is CTO of Kyzen Corporation, which is a worldwide market leader of cleaning fluids designed for electronic assembly manufacturing environments. For more information about this study, Mike can be reached via email at: mike_bix@kyzen.com