Many words have been written about the impending lead-free transition. During this period of frantic discovery, much has been communicated about reflow and alloy concerns, but the print process, which, let’s face it, is the first process that adds value, is often overlooked. 

However, this is where a process can be made or broken. Much has been documented about the differences between lead-free materials and lead-rich materials. Mainly the discussions focus on the self-centring capability and wetting characteristics, leading to questions such as, “What should I do with my aperture design” and “Will I see more assembly defects?” This paper will look at these questions, and others, such as what happens if the process window is intentionally violated.

This article originally appeared in Global SMT & Packaging magazine 6.2 - Feb 2006.

Download the full article (free) in PDF format.

Clive Ashmore is responsible for the Global Applied Process Engineering group for DEK Printing Machines. Prior to joining DEK in 1998, Ashmore held senior process and manufacturing engineering posts at Ericsson and Philips. Clive specializes in all aspects of manufacturing engineering, with special emphasis over the last five years on mass imaging technologies.