The 01005-chip component package, ranging from 0.10 x 0.304mm (0.004” x 0.012”) to 0.20 x 0.40mm (0.008” x 0.016”) depending on the supplier and if the 01005 component is a resistor or a capacitor, is dramatically smaller than the previous smallest component package used for resistors and capacitors, the 0201 (0.60 x 0.30mm (0.0236” x 0.0118”) component package. 

The use of such a miniature component presents several significant challenges solder paste printing in the areas of solder paste selection, printed circuit board pad size determination and stencil aperture design. This paper will use the latest available information and our experience to explore the issues with the development and optimization of the 01005-assembly process.

This article originally appeared in Global SMT & Packaging magazine 6.2 - Feb 2006.

Download the full article (free) in PDF format. 

Joe Belmonte, project manager at Speedline Technologies Advanced Process Group in Foxborough, Massachusetts, has been a process engineer and process engineering manager in the electronic manufacturing industry for over 27 years.

Srinivasa Aravamudhan is a development engineer at the Advanced Process Group, Speedline Technologies, Foxborough, Massachusetts.