Jetting adhesives for electronics and semiconductor packaging has provided enabling technology for high-throughput underfilling, small fillets and other applications for small, discrete amounts of material used in packaging. 

The packaging and electronic component assembly customers are pushing the edge of technology to dispense smaller amounts of adhesives and pastes for assembly of complex packages such as LCOS, OLED, Stacked Packages, DLP chips, head gimbal assemblies, white LEDs and 1 mm flip chip die. This paper will cover the advances and theory of jetting small amounts of viscous materials and the applications that provide enabling technology new semiconductor packages, LCOS, OLED & light emitting devices, miniature electronic assemblies and MEM devices.

This article originally appeared in Global SMT & Packaging magazine 6.3 - Mar 2006.

Download the full article (free) in PDF format. 

Alec J. Babiarz is senior vice president and a founder of Asymtek, a manufacturer of dispensing systems. His responsibilities include international sales and service. He also serves as vice president, new business development for Nordson Corporation, Asymtek’s parent company, and he is president of Nordson-Asymtek K.K., a Japanese company.

Alec is co-developer in 31 patents worldwide for equipment and apparatus for fluid dispensing and has written more than 15 papers and articles on fluid dispensing and jetting. He received a BSE degree from Arizona State University and MSME and MSEE degrees from Stanford University. Prior to founding Asymtek, Alec was a project manager at Hewlett-Packard and worked on ink jet technology for printers and plotters.