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Latest Headlines
Rudolph Technologies Selects Distribution Partner for Probe Card Test and Analysis Products in Europe

Tuesday, March 16, 2010

New distributor, John P. Kummer, enhances sales and support for probe analysis products in critical European markets.

SIPLACE X-Series: Maximum efficiency in LED placement

Tuesday, March 16, 2010

With new options and software functionalities, the SIPLACE team continues to expand its leadership in the rapidly growing market for LED placement technology.

Digi-Key Corporation Partners with Transim Technology and NXP Semiconductors to Launch New Design Simulation Tool

Tuesday, March 16, 2010

Digi-Key's e-commerce tools integrated as part of NXP's new SimPort Design Center developed by Transim Technology

JJS Electronics extends its test engineering expertise with valuable new addition

Tuesday, March 16, 2010

JJS Electronics Ltd. has appointed Alf Bates to the post of Principal Test Engineer.

Edwards Announces Zenith Integrated Vacuum and Abatement Systems

Tuesday, March 16, 2010

New offering addresses latest semiconductor manufacturing requirements while helping to reduce overall manufacturing costs

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Panel of Experts

The Custers
Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued "recovery" in 2010.
Bob Willis
Stencil cleaning options and board wash–offs

Inevitably all stencils need to be cleaned to remove solder paste residues from the surface of the foil and from the apertures to prevent it drying and giving missed/incomplete prints.

Joe Fjelstad
Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

Werner Engelmaier
Update on lead–free solder joint reliability

The reliability of lead-free solder joints has been addressed in previous Global SMT & Packaging columns to the extent possible at that time.

Events News

Henkel to Show Latest Materials Innovations at APEX 2010 Tuesday, March 16, 2010

Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will q...

ORPRO Vision exhibits at Apex 2010 Tuesday, March 16, 2010

ORPRO Vision is a global provider of Automated Optical Inspection solutions f...

National Electronics Week SA 2010 voted a unanimous success! Monday, March 15, 2010

The team at National Electronics Week South Africa are currently celebrating ...

Show Central

IPC APEX EXPO 2010
IPC APEX Expo 2009IPC APEX Expo is the industry's premier event - a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, input on vital industry standards, learn from new research papers and return to your company with the solutions you need. Held April 6-8, 2010 in Las Vegas, NV.

Visit our Show Central area for IPC APEX Expo 2010.
Productronica 2009
Productronica 2009Productronica is the world’s leading international trade fair for innovative electronics production. It is the only event of its kind that covers the complete range of current and forward-looking products, technologies and system solutions in their entire breadth and depth and along the entire value-added chain. As a result, it is the industry's largest and most important gathering. Held November 10-14, 2009 in Nuremberg, Germany.
Visit Productronica Show Central to watch the panel discussions on pick & place, cleaning and counterfeit components that took place as well as videos from the exhibition floor.
SMTAI 2009
SMTAI 2009The SMTAI Technical Committee was hard at work reviewing more abstracts than we have ever received at any time in the past five years. The final selection consists of 120 papers making up the industry's strongest technical program yet again! Attendees at SMTAI 2009 can look forward to 18 short courses, AIMS co-location, Emerging Technologies, the Lead-Free Symposium, the Contract Manufacturing Symposium, and a special keynote speaker from Jet Propulsion Labs. Making this year even more special is the 25th Anniversary Dinner and Celebration of SMTA's silver anniversary in the industry. Held October 4-8, 2009 in San Diego, CA.
Show Central area coming soon!
IPC Midwest 2009
If you make or buy boards or assemblies in the Midwest, mark your calendar now to attend the event that's only focused on you. From a comprehensive show floor to exceptional educational opportunities, this is the event that can change your business in 2009! Held September 23-24, 2009 in Shaumburg (Chicago), IL. Visit our Show Central area for IPC Midwest 2009.
SMT Hybrid Packaging 2009
SMT/HYBRID/PACKAGING 2009SMT Hybrid Packaging 2009 offers a comprehensive and compact presentation of products from design and development to PCB production, packaging, components and test systems. This is the Germany's leading event for System Integration in Micro Electronics. SMT Exhibition 2009 will provide an opportunity for companies gather together under one roof to exhibit their products and services that may lead to international tie-ups. Held May 5-7, 2009 in Nuremberg, Germany.

Visit our Show Central area for SMT Hybrid Packaging 2009, complete with videos from the show!
IPC APEX EXPO 2009
IPC APEX Expo 2009IPC APEX Expo is the industry's premier event - a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, input on vital industry standards, learn from new research papers and return to your company with the solutions you need. Held March 31-April 2, 2009 in Las Vegas, NV.

Visit our Show Central area for IPC APEX Expo 2009, complete with videos from the show!

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