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Saturday, January 23, 2010
Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.
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Tuesday, December 22, 2009
The best will incorporate two or more printed electronics technologies.
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Tuesday, January 26, 2010
The project, should it go ahead, will be a partnership between the UK company and the Basel Convention Regional Coordinating Centre for Africa.
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Friday, December 18, 2009
Many exhibitors from NEPCON Shanghai and NEPCON South China have already affirmed their interest in exhibiting in western China.
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Tuesday, December 22, 2009
SMART SYSTEMS INTEGRATION 2010
4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components
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Wednesday, December 23, 2009
Mini-Notes Take 19.6% of Portable PC Shipments and 10.4% of Revenues; Share to Remain Stable in 2010
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Friday, December 18, 2009
The K3000 can safely singulate standard and Aluminum panels.
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Friday, December 18, 2009
To Commemorate the Holidays, Sunstone Is Offering a Refer-A-Friend Program.
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Thursday, March 18, 2010
MARTIN GmbH trusts that these personnel changes will result in expanded market share for existing products and the opening up of new geographical areas in cooperation with finetech GmbH, Berlin.
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Thursday, March 18, 2010
CommsAudit ultimately decided that a MYDATA MY100LX was the best fit for its requirements.
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Thursday, March 18, 2010
Etek Europe will manage sales, service and spare parts with their team of experienced engineers and offer their unique 24/7 support.
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Thursday, March 18, 2010
The Kyzen Applications Laboratory has evaluated AQUANOX® A4241 and MICRONOX® MX2302 for effective removal of nearly 300 soldering materials from the world’s leading suppliers.
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Thursday, March 18, 2010
The PYRAMAX™150Nz12 is designed specifically for high volume, high throughput production environments.
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Thursday, March 18, 2010
The global semiconductor industry suffered a sharp downturn in 2009 - but no one bothered to tell the Asia-Pacific-based chipmakers.
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Thursday, March 18, 2010
GOEPEL electronic announces the extended incorporation of the Danish company DSE Test Solutions A/S into the global alliance program GATE™ (GOEPEL Associated Technical Experts).
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Thursday, March 18, 2010
ST will significantly contribute to the development of these new SoC design tools, which will give ST a head start in its ability to deliver customer-focused semiconductor chips and platforms.
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Thursday, March 18, 2010
Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C.
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Wednesday, March 17, 2010
BPM Microsystems announces the release of its latest generation Flashstream® Flash Vector Programming System, the Flashstream 2800F-MK2.
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Wednesday, March 17, 2010
Builds On Technology Leadership in Thermal Management
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Wednesday, March 17, 2010
The LTC3616 is a high efficiency, 4MHz synchronous buck regulator from Linear Technology that incorporates a constant frequency, current mode architecture.
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Tuesday, March 16, 2010
New offering addresses latest semiconductor manufacturing requirements while helping to reduce overall manufacturing costs
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Tuesday, March 16, 2010
The new BON Series PATA SSDs utilise SLC (single level cell) NAND Flash technology and are available in a 2.5 inch form factor, rugged, metal-encased package in data capacities of 8, 16, 32, 64 and 128 GBytes.
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Tuesday, March 16, 2010
E-Switch’s Introduces the LP37 Series - the Newest Illuminated Pushbutton Switch
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Monday, March 15, 2010
SMD Placement machines from Essemtec can identify the PCB using a bar-code label.
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Tuesday, February 9, 2010
Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will
strengthen Techcon Systems in these challenging times and beyond.
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Saturday, January 23, 2010
Derek LaBorie spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
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Friday, November 13, 2009
We recently spoke to Mike Scimeca, president and CEO of FCT Assembly,
about paste trasnfer, their newest pastes, and paste advances yet to
come.
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Monday, October 26, 2009
Martin Ziehbrunner
talks about the effects of the recession on Essemtec, what the company
expects in the economy next year, and the upcoming Productronica show.
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Monday, September 14, 2009
Valor is an end-to-end electronics manufacturing solution provider, delivering software solutions to every aspect of the printed circuit board supply chain.
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Monday, August 17, 2009
Born in 1970 in Kanagawa Japan, Isao Muraoka is the executive vice president of Seika Machinery Inc.
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Latest Questions...
Micro-solder balls especially in between SOIC leads
Category: Solder, flux & soldering (1 answer)
We are seeing Micro-solder balls especially in between SOIC leads in the wave soldering process
Blow hole problem
Category: Solder, flux & soldering
we are facing Blow hole problem at Through hole component at some location for one of the series 0.88% After wavesolder,verified the Preheater temp at wavesolder & pcb is passing through reflow for leadfree temp,Is this the PCB Processing issue?how we can attack this issue?
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Monday, March 1, 2010
Based on real life examples, the paper covers the key considerations, major critical factors and the challenges for a successful COB-SMT merge.
Tuesday, February 9, 2010
The use of lead-free alloys in commercial electronics has been underway for almost a decade, but the use of lead-free solder in high-reliability applications is still very limited. This is at least in part due to a reluctance to change established assembly processes without historical reliability data.
Tuesday, January 26, 2010
The project, should it go ahead, will be a partnership between the UK company and the Basel Convention Regional Coordinating Centre for Africa.
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| Bob Willis |
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Stencil cleaning options and board wash–offs
Inevitably all stencils need to be cleaned to remove solder
paste residues from the surface of the foil and from the apertures to prevent
it drying and giving missed/incomplete prints.
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| Joe Fjelstad |
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Pushing out the limits of pick and place
Miniaturization creates significant challenges to the existing infrastructure, and in many ways, pick and place technology has become a roadblock to a range of potential technical options that are not readily realizable with what is available today.
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IPC APEX EXPO 2010
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 IPC APEX Expo is the industry's premier event - a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, input on vital industry standards, learn from new research papers and return to your company with the solutions you need. Held April 6-8, 2010 in Las Vegas, NV. Visit our Show Central area for IPC APEX Expo 2010.
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Productronica 2009
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 Productronica is the world’s leading international trade fair for innovative electronics production. It is the only event of its kind that covers the complete range of current and forward-looking products, technologies and system solutions in their entire breadth and depth and along the entire value-added chain. As a result, it is the industry's largest and most important gathering. Held November 10-14, 2009 in Nuremberg, Germany. Visit Productronica Show Central to watch the panel discussions on pick & place, cleaning and counterfeit components that took place as well as videos from the exhibition floor.
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SMTAI 2009
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 The SMTAI Technical Committee was hard at work reviewing more abstracts than we have ever received at any time in the past five years. The final selection consists of 120 papers making up the industry's strongest technical program yet again! Attendees at SMTAI 2009 can look forward to 18 short courses, AIMS co-location, Emerging Technologies, the Lead-Free Symposium, the Contract Manufacturing Symposium, and a special keynote speaker from Jet Propulsion Labs. Making this year even more special is the 25th Anniversary Dinner and Celebration of SMTA's silver anniversary in the industry. Held October 4-8, 2009 in San Diego, CA. Show Central area coming soon!
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IPC Midwest 2009
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If you make or buy boards or assemblies in the Midwest, mark your calendar now to attend the event that's only focused on you. From a comprehensive show floor to exceptional educational opportunities, this is the event that can change your business in 2009! Held September 23-24, 2009 in Shaumburg (Chicago), IL. Visit our Show Central area for IPC Midwest 2009.
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SMT Hybrid Packaging 2009
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 SMT Hybrid Packaging 2009 offers a comprehensive and compact presentation of products from design and development to PCB production, packaging, components and test systems. This is the Germany's leading event for System Integration in Micro Electronics. SMT Exhibition 2009 will provide an opportunity for companies gather together under one roof to exhibit their products and services that may lead to international tie-ups. Held May 5-7, 2009 in Nuremberg, Germany. Visit our Show Central area for SMT Hybrid Packaging 2009, complete with videos from the show!
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IPC APEX EXPO 2009
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IPC APEX Expo is the industry's premier event - a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, input on vital industry standards, learn from new research papers and return to your company with the solutions you need. Held March 31-April 2, 2009 in Las Vegas, NV. Visit our Show Central area for IPC APEX Expo 2009, complete with videos from the show!
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Industry News