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Saturday, January 23, 2010
Derek LaBorie spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
Tuesday, February 9, 2010
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI.
Monday, December 14, 2009
For carriers like AT&T, the capability to garner sufficient returns from data services represents not only a matter of control of its revenue stream - but also a matter of survival.
Monday, January 18, 2010
Motorola’s share of global cell-phone shipments has been sliding over the past three years.
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Tuesday, December 15, 2009
PARALOID
Wednesday, December 23, 2009
ASYS Group Americas will combine its sales and marketing activities as well as its service network in North and South America.
Friday, December 18, 2009
Many exhibitors from NEPCON Shanghai and NEPCON South China have already affirmed their interest in exhibiting in western China.
Tuesday, December 22, 2009
X-FAB’s analogue and mixed-signal technology is ideally suited for industrial, automotive and telecommunication applications.
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Friday, March 12, 2010
Apricot Materials Technologies Virtual Nano Electrode Technology, (VNE
Friday, March 12, 2010
Nordson YESTECH has spent months putting together the new web site to create a more informative, functional site, attuned to the needs of its clients around the world.
Friday, March 12, 2010
The solder paste line includes no-clean lead-free, water soluble lead-free, and Pb no-clean and water soluble.
Friday, March 12, 2010
MIRTEC will feature the latest in their award winning MV-7 Series; the MV-7xi In-Line AOI System at the upcoming Nepcon Korea show.
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Friday, March 12, 2010
The SEHO MaxiReflow is equipped with the latest cyclone technology.
Friday, March 12, 2010
Since 1993, JUKI makes efforts to provide better products and service with the philosophy of 3E which means providing products with ease of operation, more economy and helping expand industrial scale.
Friday, March 12, 2010
Advanced Rework Equipment on Display at German Pavilion
Friday, March 12, 2010
Integrating Facebook, or any other social networking platform, allows users to connect with an already existing network of persons that they actually know and care about.
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Friday, March 12, 2010
Custom options available: applications include user interface controls for vehicles and gaming consoles
Friday, March 12, 2010
![]( "16-Bit Quad DAC with </p>
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Friday, March 12, 2010
Allows Wider Range of Applications
Friday, March 12, 2010
The SFS2365A-LF is also ideal for automated surface mount assembly and reflow.
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Thursday, March 11, 2010
The integrated label feeder can feed labels with any code: bar codes, matrix codes, date or serial numbers are possible.
Thursday, March 11, 2010
The SFS1720A-LF is a single frequency synthesizer that operates at 1720 MHz.
Thursday, March 11, 2010
New MCUs feature less than 50 µA/MHz active current and industry-leading peripheral integration
Wednesday, March 10, 2010
All important software functions can be controlled by a single touch of a button to ensure simplicity.
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Tuesday, February 9, 2010
Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will
strengthen Techcon Systems in these challenging times and beyond.
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Saturday, January 23, 2010
Derek LaBorie spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
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Friday, November 13, 2009
We recently spoke to Mike Scimeca, president and CEO of FCT Assembly,
about paste trasnfer, their newest pastes, and paste advances yet to
come.
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Monday, October 26, 2009
Martin Ziehbrunner
talks about the effects of the recession on Essemtec, what the company
expects in the economy next year, and the upcoming Productronica show.
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Monday, September 14, 2009
Valor is an end-to-end electronics manufacturing solution provider, delivering software solutions to every aspect of the printed circuit board supply chain.
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Monday, August 17, 2009
Born in 1970 in Kanagawa Japan, Isao Muraoka is the executive vice president of Seika Machinery Inc.
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Latest Questions...
Micro-solder balls especially in between SOIC leads
Category: Solder, flux & soldering (1 answer)
We are seeing Micro-solder balls especially in between SOIC leads in the wave soldering process
Blow hole problem
Category: Solder, flux & soldering
we are facing Blow hole problem at Through hole component at some location for one of the series 0.88% After wavesolder,verified the Preheater temp at wavesolder & pcb is passing through reflow for leadfree temp,Is this the PCB Processing issue?how we can attack this issue?
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Monday, March 1, 2010
Based on real life
examples, the paper covers the key considerations, major critical factors and
the challenges for a successful COB-SMT merge.
Tuesday, February 9, 2010
The use of lead-free alloys in commercial electronics has been underway for almost a decade, but the use of lead-free solder in high-reliability applications is still very limited. This is at least in part due to a reluctance to change established assembly processes without historical reliability data.
Tuesday, January 26, 2010
The project, should it go ahead, will be a partnership between the UK company and the Basel Convention Regional Coordinating Centre for Africa.
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| Bob Willis |
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Stencil cleaning options and board wash–offs
Inevitably all stencils need to be cleaned to remove solder
paste residues from the surface of the foil and from the apertures to prevent
it drying and giving missed/incomplete prints.
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| Joe Fjelstad |
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Synergy, the Occam process and twisted wire interconnect
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI.
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IPC APEX EXPO 2010
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 IPC APEX Expo is the industry's premier event - a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, input on vital industry standards, learn from new research papers and return to your company with the solutions you need. Held April 6-8, 2010 in Las Vegas, NV. Visit our Show Central area for IPC APEX Expo 2010.
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Productronica 2009
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 Productronica is the world’s leading international trade fair for innovative electronics production. It is the only event of its kind that covers the complete range of current and forward-looking products, technologies and system solutions in their entire breadth and depth and along the entire value-added chain. As a result, it is the industry's largest and most important gathering. Held November 10-14, 2009 in Nuremberg, Germany. Visit Productronica Show Central to watch the panel discussions on pick & place, cleaning and counterfeit components that took place as well as videos from the exhibition floor.
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SMTAI 2009
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 The SMTAI Technical Committee was hard at work reviewing more abstracts than we have ever received at any time in the past five years. The final selection consists of 120 papers making up the industry's strongest technical program yet again! Attendees at SMTAI 2009 can look forward to 18 short courses, AIMS co-location, Emerging Technologies, the Lead-Free Symposium, the Contract Manufacturing Symposium, and a special keynote speaker from Jet Propulsion Labs. Making this year even more special is the 25th Anniversary Dinner and Celebration of SMTA's silver anniversary in the industry. Held October 4-8, 2009 in San Diego, CA. Show Central area coming soon!
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IPC Midwest 2009
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If you make or buy boards or assemblies in the Midwest, mark your calendar now to attend the event that's only focused on you. From a comprehensive show floor to exceptional educational opportunities, this is the event that can change your business in 2009! Held September 23-24, 2009 in Shaumburg (Chicago), IL. Visit our Show Central area for IPC Midwest 2009.
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SMT Hybrid Packaging 2009
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 SMT Hybrid Packaging 2009 offers a comprehensive and compact presentation of products from design and development to PCB production, packaging, components and test systems. This is the Germany's leading event for System Integration in Micro Electronics. SMT Exhibition 2009 will provide an opportunity for companies gather together under one roof to exhibit their products and services that may lead to international tie-ups. Held May 5-7, 2009 in Nuremberg, Germany. Visit our Show Central area for SMT Hybrid Packaging 2009, complete with videos from the show!
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IPC APEX EXPO 2009
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IPC APEX Expo is the industry's premier event - a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, input on vital industry standards, learn from new research papers and return to your company with the solutions you need. Held March 31-April 2, 2009 in Las Vegas, NV. Visit our Show Central area for IPC APEX Expo 2009, complete with videos from the show!
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Industry News