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Global SMT August 2015 (15.8)
Global SMT & Packaging Magazine
15.08 Read it Online

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Datest announces quick-turn troubleshooting service with the installation of its XD7600NT500 Ruby X-ray inspection system from Nordson DAGE

Industry News

Nordson_DAGE_Ruby_2xscreenDatest, a provider of advanced, efficient and mission-critical in-circuit testing, test engineering, and X-ray inspection solutions, has successfully installed a  XD7600NT500 Ruby X-ray Inspection System with X-Plane™ technology from Nordson DAGE.

Datest will use the XD7600NT500 Ruby X-ray system for internal troubleshooting and failure analysis activities. Additionally, the system will be available to Datest customers in need of fast, accurate resolution of unique or “one-off” problems. Head-in-pillow (HiP) defects, package-on-package (PoP) defects and micro-cracks, among other issues, will be addressed. As part of the new acquisition, Datest plans to implement a quick-turn troubleshooting service for OEM and CM engineers.

The implementation of the XD7600NT500 Ruby X-ray improves Datest’s troubleshooting, failure analysis and bonepile rehabilitation efforts. The X-Plane™ technology speeds up the detection of defects that previously were undetectable with conventional X-ray technology without damaging the board. Additionally, the X-Plane™ software enables the user to obtain a nondestructive, virtual cross-section of the area of interest.

Datest’s President Rob Boguski commented about the new service: “We are elated to introduce the DAGE X-ray service at Datest. We believe it fills a significant void in the marketplace for in-depth, rapid response failure analysis. Now we can offer our customers the benefit of a choice between full-blown X-ray inspection using Agilent 5DX and Goepel Opticon technology or highly-focused, detail-oriented, digital tomographic fault diagnostics using the power and precision of the DAGE Ruby X-ray system with X-Plane™ technology.”

With the revolutionary X-Plane™ option, the superior image quality that Nordson DAGE X-ray systems always provide now can be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane™ uses a proprietary, patent applied for, tomosynthesis (or CT technique) to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board.


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