The global assembly journal for SMT and advanced packaging professionals




iPad Application

Global SMT & Packaging Advertising

America
Sandy Daneau
sdaneau@globalsmt.net
Tel: (239) 245-9264 x104

Europe
Alex Klocksin
aklocksin@globalsmt.net
Tel: +49.1577.893.4884


SE Asia
Debasish Choudhury
dchoudhury@trafalgarmedia.com
Tel: +91-9811710191

China
Paul Chen
Office: +86 2154049130
pchen@trafalgarmedia.com

Korea
Keon Chang
Young Media Inc.
ymedia@ymedia.co.kr
Tel: +82 2 2273 4833

Subscriptions
subscriptions@globalsmt.net
Tel: +1 (239) 245-9264 x106

Editorial
editor@globalsmt.net
Tel: +1 (239) 245-9264 x101

Email ad materials to ads@globalsmt.net

Register now for SMTA lead–free programs

SMTA Lead-Free Academy
May 15, 2006, Wyndham Bristol Hotel Mississauga, Ontario, Canada

Attend Courses covering:

  • SMT Lead-Free Manufacturing & Troubleshooting
  • Lead-Free Soldering Metallurgical Fundamentals
  • Failure Modes
  • Optimal Processes

Register for the SMTA Lead-Free Academy by April 17th and save 10%. For complete course descriptions and more information visit http://www.smta.org/education/academy/academy.cfm#lead-free

To register for the Lead-Free Academy visit www.cmap.ca or call SMTA Educational Programs Coordinator Melissa Serres at 952-920-7682

Rapid Implementation of WEEE and RoHS Compliant Assembly Workshop
May 18, 2006, Guidant Corporation, St. Paul, MN

This full day workshop will be taught by industry renowned experts Dr. Ronald Lasky, Indium Corporation of America/Dartmouth College and Timothy Jensen, Indium Corporation of America. Acquire the knowledge that over one hundred of your colleagues who have already taken this course hold.

For information on this one day event visit http://www.smta.org/education/academy/academy.cfm#lead-free_workshop Cost to attend is $425 for SMTA members and $525 for non-members.

Share your knowledge in 2006
Speak at an upcoming SMTA event! The call for participation is out for the following events:

Harsh Environments Electronics Workshop
SMTA International
Wafer-Level Packaging Conference

Add comment


Security code
Refresh

Your Account






Forgot login? Click here.
No account yet? Subscribe