While still being held in its’ rotational city, the conference this year will be held in a more elegant hotel than Caesar’s, where it has been held for many years while in this city.  So while Las Vegas is still known as Sin City, some form of elegance can be obtained while at the conference.

So the question is, will the engineers who attend this conference behave in an elegant style? 

There will be 36 oral sessions and five poster sessions.  Broad categories include:

• Advanced Packaging
• Electronic Components & RF
• Emerging Technologies
• Interconnections
• Assembly & Manufacturing Technology
• Materials & Processing
• Modeling & Simulation
• Optoelectronics
• Applied Reliability

Highlights include the following:

A special focus on 3D silicon packaging technologies with over six sessions dedicated to through silicon via (TSV), via fill, silicon bonding, and applications.

Four special (invited) sessions:

"The Emergence of the Medical Devices Industry through the View-glass of Microelectronic Packaging Innovation" (Tuesday, June 1, 7:30 pm) will explain how new product functions are being enabled by medical device packaging innovations.

"The Evolution of Mobile Processing Architectures " (Wednesday, June 2, 7 pm) will discuss the evolution of mobile processing architectures as well as drivers for new silicon and packaging technologies.

"Advanced Bump and Bump-less Interconnection Technologies" (Thursday, June 3, 8 pm) will focus on several advanced interconnection technologies in Japan designed to meet increasing high pin count and fine pitch requirements.

"RFID and RFID-enabled Sensors: Packaging, Reliability, and Integration" (Tuesday, June 1, 9 am) will address the technology challenges in materials, reliability, assembly, interconnects, passives, and integration with sensors and power sources.

Sixteen professional development courses (PDC’s) are being prepared - eight in the morning and eight in the afternoon of June 1. These courses are targeted for in-depth half day learning or re-visiting of key technologies in our industry.

The Technology Corner
Leading companies primarily in the electronics components, materials, and packaging fields exhibit their latest technologies and products on June 2 and 3.

For more information about the 60th ECTC, please visit www.ectc.net.