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The global assembly journal for SMT and advanced packaging professionals

SMTAI 2011

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Written by obwain

To be presented at SMTA International 2011

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KIC’s Marybeth (MB) Allen to participate in Doctor’s Hours at SMTAI

Written by obwain

Marybeth (MB) AllenDuring the Doctor’s Hours, MB will offer advice related to reflow soldering, including profiling, process control and thermal management.

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Christopher Associates’ Jasbir Bath to Present at SMTAl 2011

Written by obwain

Christopher_Assoc_Jasbir_Bath_RJasbir Bath to present “An Investigation into Low Silver Lead-Free Alloy Solder Paste”.

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FCT Assembly to showcase proven solder paste and stencil technologies at SMTA International 2011

Written by obwain

FCT_Assembly_WS159_RWS159 water-soluble solder paste offers best-in-class solder spread and wetting.

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JBC Tools Inc. to highlight Advanced Hand Soldering and Rework Tools at SMTAI

Written by obwain

Nano StationStop by Booth #609 at SMTA International to see JBC Tools’ Nano Station, a complete station designed for micro soldering and desoldering of small-size components.

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Nihon Superior to introduce the newest addition to the SN100C Lead-Free Solder Series at SMTAI 2011

Written by obwain

Nihon_Superior_SN100C_044_RThe SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected.

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Learn about Kyzen’s New AQUANOX® A4638 Advanced Packaging Cleaning Chemistry at SMTAI 2011

Written by obwain

AQUANOX® A4638AQUANOX® A4638 was developed to rapidly dissolve water-soluble polar flux residues and exhibits a low surface tension.

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Krayden to Showcase Cutting-Edge Technologies at SMTA International 2011

Written by obwain

Krayden is a “NASA top 100 Supplier,” “Dow Corning Electronics Distributor of the Year 2008, 2009 & 2010,” Certified AS 9120, ISO 9001:2008, and now offers Dow Corning Solar Solutions.

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See BPM Microsystems’ 2800 Universal Device Programmer at SMTA International 2011

Written by obwain

BPM Microsystems’ 2800The 2800 combines the unrivaled speed of Vector Engine Co-Processor® technology plus true universal device support, resulting in the fastest universal programmer in the industry.

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DGMarketing Inc. to highlight KIC’s MVP Profile Fixture at SMTA International 2011

Written by obwain

KIC_MVP_RThe MVP profile fixture is ideal for viewing changes in reflow ovens and determining how those changes affect the profile of production boards.

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Evolving Technologies Summit looks to the future of LEDs, ECT, and printed electronics at SMTA International

Written by obwain

The purpose of the summit is to present the key issues in packaging, SMT, LED, Solar and printed electronics in order to gain insight about the way technology will change in the future.

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SMTA International to hold Alternate Alloys Sessions

Written by obwain

SMTA_RPapers from Henkel, Nihon Superior Co., Indium Corporation, Senju Comtek Corporation, and Christopher Associates/Koki Solder will be presented.

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SMTA International Focuses on Package-on-Package

Written by obwain

SMTA_RLee Smith, Amkor Technology, will chair a session titled "Assembly Solutions for Next Generation Package on Package (PoP) Requirements and Process" and "Reliability Characterization of PoP Materials and SMT Processes".

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SMTA International tackles Head-in-Pillow Defects

Written by obwain

Dudi Amir, Intel Corporation, will discuss Head-in-Pillow defects in depth in his tutorial.

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Kyzen shows continued support of the SMTA by sponsoring SMTA International 2011

Written by obwain

Tom Forsythe, Vice President of Kyzen“Kyzen has been an active SMTA Corporate member for many years,” commented Tom Forsythe, Vice President of Kyzen.

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FHP Reps LLC to exhibit at SMTA International 2011

Written by obwain

Representatives from FHP Reps will display products from varius companies.

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Production Solutions to highlight the New RED-E-SET GO! at SMTAI 2011

Written by obwain

RED-E-SET GO!The GO! removes board sag, dampens board bounce, and is entirely hands- and tool-free.

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A-Laser to highlight UV Laser Depaneling at SMTA International 2011

Written by obwain

Laser cutting technology has taken the precision parts industry to new levels, enabling increased complexity in design, higher cut quality and the ability to maintain tighter tolerances.

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Juki to demonstrate Industry-Leading SMT Assembly Systems at SMTAI 2011

Written by obwain

FlexSolder W510The FlexSolder W510 is able to handle dual mini-waves for simultaneous or individual use.

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Valor Division of Mentor Graphics to highlight software solutions at SMTAI

Written by obwain

With more than 930 customers in 45 countries, the Valor Division of Mentor Graphics understands the complexity and dynamic nature of the electronics industry and the business challenges facing our customers.

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