SMTAI 2011

To be presented at SMTA International 2011

During the Doctor’s Hours, MB will offer advice related to reflow soldering, including profiling, process control and thermal management.

Jasbir Bath to present “An Investigation into Low Silver Lead-Free Alloy Solder Paste”.

WS159 water-soluble solder paste offers best-in-class solder spread and wetting.

Stop by Booth #609 at SMTA International to see JBC Tools’ Nano Station, a complete station designed for micro soldering and desoldering of small-size components.

The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected.

AQUANOX® A4638 was developed to rapidly dissolve water-soluble polar flux residues and exhibits a low surface tension.

Krayden is a “NASA top 100 Supplier,” “Dow Corning Electronics Distributor of the Year 2008, 2009 & 2010,” Certified AS 9120, ISO 9001:2008, and now offers Dow Corning Solar Solutions.

The 2800 combines the unrivaled speed of Vector Engine Co-Processor® technology plus true universal device support, resulting in the fastest universal programmer in the industry.

The MVP profile fixture is ideal for viewing changes in reflow ovens and determining how those changes affect the profile of production boards.

The purpose of the summit is to present the key issues in packaging, SMT, LED, Solar and printed electronics in order to gain insight about the way technology will change in the future.

Papers from Henkel, Nihon Superior Co., Indium Corporation, Senju Comtek Corporation, and Christopher Associates/Koki Solder will be presented.

Lee Smith, Amkor Technology, will chair a session titled "Assembly Solutions for Next Generation Package on Package (PoP) Requirements and Process" and "Reliability Characterization of PoP Materials and SMT Processes".

Dudi Amir, Intel Corporation, will discuss Head-in-Pillow defects in depth in his tutorial.

“Kyzen has been an active SMTA Corporate member for many years,” commented Tom Forsythe, Vice President of Kyzen.

Representatives from FHP Reps will display products from varius companies.

The GO! removes board sag, dampens board bounce, and is entirely hands- and tool-free.

Laser cutting technology has taken the precision parts industry to new levels, enabling increased complexity in design, higher cut quality and the ability to maintain tighter tolerances.

The FlexSolder W510 is able to handle dual mini-waves for simultaneous or individual use.

With more than 930 customers in 45 countries, the Valor Division of Mentor Graphics understands the complexity and dynamic nature of the electronics industry and the business challenges facing our customers.