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Special Features

World premiere of FLEXUS-pick-and-place platform at SMT Hybrid Packaging 2013

Written by dburford Friday, 12 April 2013 15:01

Flexus_PressEssemtec expands its range of machines with the new pick-and-place machine FLEXUS. The machine is tied to the established FLX system, but offers a greater flexibility in the high-mix/mid-volume sector.
For years, Essemtec’s FLX was the world’s most popular pick-and-place machine for flexible SMD production. Many specific customer applications were solved using the FLX and a wide range of options and accessories have been designed for the platform.

 

Universal features Fuzion platform at SMT Nuremberg

Written by dburford Friday, 12 April 2013 09:45

FuzionXC237_top_downInnovative and flexible platform maximizes revenue opportunities and utilization, delivering an impressive return on investment. 
Universal Instruments will formally introduce its Fuzion™ Platform to the European market at the SMT Hybrid Packaging trade show April 16–18 at the Exhibition Centre Nuremberg in Germany. Universal is exhibiting on booth 7-219 in cooperation with its channel partner, smartTec GmbH.

   

ASC’S products will be demonstrated in two booths during NEPCON China 2013

Written by dburford Thursday, 11 April 2013 00:00

ASC_VP450ASC International, a manufacturer of 3-D solder paste inspection and automated optical inspection (AOI) systems, announces that its products will be showcased in two booths at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center. The VisionPro AP500 will be displayed in Kasion Automation Limited’s (KAL) Booth – 1G56, and the VisionPro M300 will be on displayed in Smartop’s Booth – 1J23.
 

Rehm Thermal Systems show VisionXP+ for the first time at SMT

Written by dburford Thursday, 11 April 2013 00:00

On display at SMT Nuremberg for the first time will be Rehm Thermal Systems’ VisionXP+ . Visitors to Hall 7, Stand 7-329 will be able to see yet another creative development from the award-winning Rehm, designed to enhance convection reflow productivity and boost energy efficiency.  The VisionXP+ can reduce energy consumption by up to 20%. 
The VisionXP+ system is based on the tried and tested VisionXP and combines numerous developments and optimising features that focus on energy efficiency, reduction of emissions and operating costs.

   

Nordson ASYMTEK Demonstrates Precision Dispensing and Coating at SMT Hybrid Packaging, smartTec Stand #7-219

Written by obliqik Wednesday, 10 April 2013 18:34

Participating in Future Packaging Line for Electronics with NexJet System  

Carlsbad, CA, USA – 10 April 2013– Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, will demonstrate its SelectCoat® SL-940E conformal coating system with dual applicators as well as a surface mount adhesive dispensing platform at SMT Hybrid Packaging, Nuremberg, smartTec GmbH stand #7-219. In addition, Nordson ASYMTEK’s

 

ESSEMTEC to highlight a range of leading-edge technologies at SMT Hybrid Packaging 2013

Written by dburford Wednesday, 10 April 2013 16:38

Scorpion_PRESSFor years, Essemtec’s FLX was the world’s most popular pick-and-place machine for flexible SMD production. Many specific customer applications were solved using the FLX and a wide range of options and accessories have been designed for the platform. Now Essemtec introduces FLEXUS, which builds on the proven concepts of the FLX and expands the potential due to a new, modern H-drive. This minimizes maintenance and increases the working surface.

   

Industry-leading SCS Precisioncoat to be on exhibit at SMT Hybrid Packaging 2013

Written by dburford Wednesday, 10 April 2013 16:10

image001-7The industry-leading SCS Precisioncoat spray coating and dispense system will be on exhibit at SMT Hybrid Packaging 2013 in Nuremberg, April 16-18, 2013. SCS Equipment Manager Brad Banfill will be available at the SmartRep stand, 7-419, to answer questions and assist in coating system demonstrations. 
Visitors are also invited to join a presentation by SmartRep application engineer Sebastian Aulbach. The presentation, “Conformal coating of electronic components with SCS Precisioncoat,” will take place in stand 7-419 on Wednesday, April 17, at 11:40 a.m.
 

CyberOptics to present award-winning SPI and AOI inspection solutions at NEPCON China

Written by dburford Wednesday, 10 April 2013 15:00

CyberOptics_QX600CyberOptics Corporation (Nasdaq: CYBE) will present its award-winning SPI and AOI inspection solutions in booth 1G55 at NEPCON China 2013, scheduled to take place April The QX600™ AOI System comes with an all-new Strobed Inspection Module (SIM) with enhanced illumination – delivering the best 01005 and solder joint inspection ever. A higher sensor resolution (12 µm) captures brilliant and crisp quality images for accurate defect review analysis.

   

MYDATA to unveil innovative new productivity boosters at SMT Hybrid Packaging

Written by obliqik Wednesday, 10 April 2013 14:40

At this year’s SMT Hybrid Packaging show in Nuremberg, MYDATA will showcase its latest solutions for non-stop productivity. Highlights include an entirely new material handling software with outstanding ease of use, and the latest advances in jet printing technology.

 

ALPHA® 2013 SMT Hybrid

Written by obliqik Wednesday, 10 April 2013 14:28

ALPHA® shows no-clean solder paste, high-performance, fast wetting cored wires and Aspen, an application to identify suitability and value of low temperature processing at SMT/Hybrid.

   

AIM Solder brings low-cost, lead-free solder paste to NEPCON China 2013

Written by dburford Tuesday, 09 April 2013 00:00

AIM_NC259This low-cost, lead-free and halogen-free solder paste offers the performance of tin/lead and high-silver, lead-free solder pastes. Now manufacturers can attain the SMT soldering results they require while paying significantly less per gram than with traditional lead-free solder pastes. NC259 provides excellent print definition and sustainable solder volume transfer as the demand for smaller pads increases. Proven to mitigate head-in-pillow defects, NC259 reduces rework and rejected board costs for the manufacturer.

 

Kasion Automation to demonstrate BPM Microsystems’ 2800ISP device programmer at NEPCON China 2013

Written by dburford Monday, 08 April 2013 15:57

BPM_Micro_2800ISPIdeal for medium- to high-volume production, the 2800ISP is configurable and can program up to 16 devices in parallel. Like all 8th Generation programmers, the 2800ISP with BPM’s Vector Engine Co-Processor is capable of achieving an amazing peak operating rate of 24Gbits per second. This solves the test bottleneck while allowing the operator to program the latest data just in time, all while attaining a very low programming cost per device.

   

Easy stencil printer adjustment due to new features

Written by dburford Monday, 08 April 2013 13:10

Fino_PressThe Fino offers professional print process control paired with the flexibility of a semiautomatic tabletop printer. The following features make Fino different than other tabletop printers: A touch screen programming terminal, laser-guided vision alignment, and a pneumatic fast-fixation for screen and stencil tension frames. Furthermore, all motions of the squeegee and the print table are motorized and, therefore, are both programmable and reproducible. Because of these features, Fino’s setup and changeover is much quicker than other machines and the print quality is better.

 

TRI bests competition with SPI closed loop system plug & play demonstration

Written by dburford Monday, 08 April 2013 00:00

TRI_closed_loopTest Research, Inc. (TRI) has proven its expertise in SPI systems and manufacturing line integration by successfully demonstrating a closed loop SPI solution with solder paste printer and buffer, working from the get-go.
TRI’s Jim Lin commented “Our expert field engineers have proven that TRI’s integrated solutions are ready to deploy with only minimal tuning required on site, a key advantage over our competitors.” The test positively contrasted with competing solutions, which took weeks of tuning to optimize.
   

Preview for Seica SpA for SMT Nuremberg Show, April 2013, 16th to 18th , booth # 7-618

Written by dburford Friday, 05 April 2013 15:59

Renate-CompactLike all of Seica’s solutions, the Compact Line  software and hardware are based on the core proprietary VIP platform that can be specialized for multiple applications. , It includes systems dedicated to in-circuit test, on-board programming of digital devices, functional and end-of-line board testing (EOL), with the possibility of having a manual or fully automated UUT loading/downloading system. The solutions find one of the major application in the automotive industry, supporting the customer in reaching the best quality targets.

 

See Production Solution’s RED-E-SET Line at SMT/Hybrid/Packaging 2013

Written by dburford Friday, 05 April 2013 12:26

Production_Solutions_RED_E_SET_SZ_GO2Production Solutions Inc., manufacturer of the industry-leading Red-E-Set Board Support System, will showcase the RED-E-SET ML in distributor Multi-Components Stand 320, Hall 7 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
The RED-E-SET ML units work with most inline screen printers, dispensers, placement machines, chipshooters and many AOI systems. Models also are available for semi-automatic machines.
   

Juki and Cogiscan to introduce new line software at SMT Hybrid Packaging 2013

Written by dburford Friday, 05 April 2013 08:46

The Juki line software solution was developed in collaboration with their long-term partner Cogiscan. The software is a natural extension of the award-winning IFS Intelligent Feeder System for Juki placement machines. It provides the same level of closed-loop validation, tracking and traceability for other types of SMT machines and related materials. Juki offers this software under the existing OEM reselling agreement as an extension of IFS.

 

Mek to unveil new AOI technology line-up at SMT Nuremberg, booth # 7-419

Written by dburford Friday, 05 April 2013 00:00

Mek, formerly known as Marantz Business Electronics, has announced the release of an entirely new generation of AOI technology to be deployed across a line of new Desktop and In-line inspection machines.
Mek’s latest PowerSpector Series with FDAz head features an entirely new generation of mechanical, camera, sensor, and software technologies that measurably propel the performance of Mek AOI beyond the norm and create new standards for speed, accuracy and inspection strategy.

   

Meet the Kyzen team at NEPCON China to learn about its cutting-edge cleaning solution for batch spray systems

Written by dburford Wednesday, 03 April 2013 17:14

Kyzen_A4639Kyzen announces that it will showcase its AQUANOX® A4639 Electronic Assembly Aqueous Solution in Booth #1F02 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center. The easy-to-control A4639 protects solder joints from chemical attacks and is effective on B-side misprints. The biodegradable aqueous solution does not contain CFCs or HAPs.

 

Experience the speed of Yamaha solutions at SMT Hybrid Packaging 2013

Written by dburford Wednesday, 03 April 2013 11:29

Yamaha_IME_bike_2The world’s shortest high-speed dual-lane surface-mount production line will provide the centerpiece of the Yamaha Intelligent Machines (Yamaha IM) stand at SMT Hybrid Packaging 2013 in Nuremberg, as the company launches its Trusted Technology campaign demonstrating the advantages of its flexible, cohesive solutions for Europe’s high-tech manufacturers.

   

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