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Global SMT & Packaging Advertising

Sandy Daneau
Skype: sdaneau.1
Tel: 239-234-1600

Trevor Galbraith
Tel: +1 (239) 287 5401

SE Asia
Debasish Choudhury
Tel: +91-9811710191

China & Japan
Paul Chen
Office: +86 2154049130

Tel: +1 (239) 245-9264 x106

Tel: +1 (239) 245-9264 x101

Email ad materials to ads@globalsmt.net

Industry News

JUKI celebrates the sale of the 20 thousandth automatic mounting machine in Tokyo

Monday, 29 September 2008 06:00

Mr. Hirokazu Nagashima, Managing Director and Division Manager of JUKIIn addition to members of the JUKI corporation and its worldwide subsidiaries, the celebrations were also attended by longstanding business partners.

Agilent Technologies, Altron Inc. Announce Altron's Selection of Agilent Medalist sj5000 AOI System

Monday, 29 September 2008 06:00

Agilent Medalist sj5000 AOI SystemDeveloped to tackle today's complex and shrinking printed-circuit-board assemblies, the Agilent Medalist sj5000 can inspect even the smallest 01005 components, with no compromise in speed and resolution.

IPC/SMTA Announces Cleaning Material Panel

Monday, 29 September 2008 06:00

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Panel Discussion on Electronic Equipment Designs

Digi–Key Corporation and connectBlue™ Ink Global Distribution Agreement

Monday, 29 September 2008 06:00

connectBlue products, available for purchase directly from Digi-Key, are featured in its online catalogs and will appear in future print catalogs.


See the Future of Consumer Electronics at iSuppli/Micon Israel Briefing

Monday, 29 September 2008 06:00

The future of the consumer electronics industry is mobile, wireless, ubiquitous, socially networked, easy to use and visually stunning. Is your company ready?

Akrometrix broadens organization to prepare for global expansion

Friday, 26 September 2008 06:00

Both are new positions created to help leverage the company’s track record of high growth into new markets.


MEPTEC and Advanced Packaging Magazine Announce Symposium to Celebrate MEPTEC's 30th Year

Friday, 26 September 2008 06:00

Over the past 30 years, MEPTEC has supported the packaging engineering community to inform and help set industry standards, helping to drive the backend assembly and test infrastructure forward.

OK International looks forward to Forum de l’Electronique 2008

Friday, 26 September 2008 06:00

OKI MX-5000The OK International team will also be demonstrating the innovative MFR-2200 Series Soldering and Rework System, a high power, flexible solution for production hand soldering, touch-up and SMD rework.

Seika's Ogihara Attends CMHA Luncheon

Friday, 26 September 2008 06:00

Michelle Ogihara of Seika Machinery presents the donation check to Margie Penny, the president of the Children’s Memorial Hospital AuxiliaryMichelle Ogihara Attends CMHA Annual Membership Luncheon

Colibrys and Avnet Electronics Marketing sign franchise agreement for North America

Friday, 26 September 2008 06:00

Colibrys and the Avnet Electronics Marketing business region of Avnet, Inc. (NYSE: AVT), today announced Avnet will distribute Colibrys’ full line of motion sensors in North America.


Leading Optical Wave Guide Manufacturer Completes Thermal Oxide Retrofit with RASIRC Steamers

Friday, 26 September 2008 06:00

Reduced annual costs by $100,000 & increased TOx capacity 17% per furnace tube

IPC honors volunteers for their contributions to IPC Stabdards and Program Development

Friday, 26 September 2008 06:00

More than 70 Awards Presented at IPC Midwest




Thursday, 25 September 2008 06:00

SMTA Long Island will be held October 22-23, 2008 at the Hyatt Regency Long Island in conjunction with the SMTA Long Island Chapter Vendor Show.

Akrometrix announces new President/CEO

Thursday, 25 September 2008 06:00

Mr. Khoury brings to Akrometrix more than 26 years of experience managing global high technology companies.

NEW–look National Electronics Week for 2009

Thursday, 25 September 2008 06:00

Being held at London’s Earls Court 2 over 16th - 18th June, the 2009 show will take this commitment even further with the launch of dedicated environments for Production/EMS, Test, Solar/PV, Wireless, Embedded Systems and Components.

iSuppli's FID 2008 to Bring Together World's Leading Display Experts

Thursday, 25 September 2008 06:00

The conference will cover key trends impacting displays, track the direction of trends to maximize value and determine where value is created and destroyed in the display chain.

Microscan To Purchase Siemens’ Machine Vision Business

Thursday, 25 September 2008 06:00

Acquisition expands technology leadership in traceability solutions and strengthens global sales channel


Taiwan Materials Industry Veteran Dr. I–lin Cheng Added to RNT Advisory Board

Thursday, 25 September 2008 06:00

Dr. Cheng is currently an adjunct professor of Materials Science at National Cheng Kung and also at National Sun Yet-sen University for Technology and Innovation Management in Taiwan.


Palomar Technologies Features LED Packaging Methods at LEDs 2008

Thursday, 25 September 2008 06:00

Palomar Technologies will feature Palomar Microelectronics, its high value-added microelectronic packaging services, and its methods for packaging LEDs at the LEDs 2008 conference.

SMART Group proudly announces participation in the EKTN Event at Midlands Ricoh Arena

Wednesday, 24 September 2008 06:00

SMART Group will support EKTN (Electronics Knowledge Transfer Network) to organize the Seminar Programme entitled

IFF 2008 to explore the density and intelligence implications for next generation systems

Wednesday, 24 September 2008 06:00

Dates for diary : 8 -10 October 2008, Vienna, Austria

Following the success of the 2007 IFF forum in Prague, IFF 2008 features senior executives from some of the world’s leading SoC and semiconductor companies.


Indium Corporation Features BIG! Solder Paste at Mexitronica

Wednesday, 24 September 2008 06:00

Indium 8.9 CartridgeIt also offers the benefit of being extremely thermally stable and maintaining a soft, pliable residue after reflow.  This means easier probe-testability and fewer false rejects during in-circuit testing.

picoChip and Wintegra technology is

Wednesday, 24 September 2008 06:00

Company provides standard in WiMAX CPE shootout; 4G network architecture is key theme
WiMAX World Forum, Chicago, USA
September 30th

Digi–Key Corporation and Alpha & Omega Semiconductor Sign Global Distribution Agreement

Wednesday, 24 September 2008 06:00

This new distribution agreement will enable Digi-Key to fulfill both the design and production quantity needs of its very diverse customer base.

Hands–On Conformal Coating Application & Inspection

Wednesday, 24 September 2008 06:00

To be held on Tuesday 7th October at Henkel Research Labs, Hemel Hempstead

Novatec continues their tradition of breakthrough technologies at Forum de l’electronique

Wednesday, 24 September 2008 06:00

On rails boardProcessWatch enables manufacturers to trace boards and record events throughout the assembly process and keep track of associated consumables, stencils and tooling.


Executive’s Guide to Environmental Megatrends

Tuesday, 23 September 2008 06:00

Newly Published IPC Guide to Environmental Megatrends Steers Companies through Environmental Regulations and Issues

IPC White Paper Voices Technical Perspective on Proposed Revisions to RoHS Directive

Tuesday, 23 September 2008 06:00

The white paper is the culmination of presentations made during an IPC workshop on June 18, 2008, in Brussels.

Balver Zinn Speeds Customer Interaction with Updated Website

Tuesday, 23 September 2008 06:00

The expanded Website lists Balver Zinn’s extensive global sales network, with contact information for local access to electronics products for assembly, components, PCB and solder support.

HEIDENHAIN Selects Valor’s End–to–End DFM Solution

Tuesday, 23 September 2008 06:00

HEIDENHAIN develops and provides products to manufacturers of machine tools and manufacturers of automated facilities and machines, especially for semiconductor and electronics manufacturing.

Wire Bond Inspection; Invitation to Semicon, Stuttgart

Tuesday, 23 September 2008 06:00

Bare chip with thin gold wire bondInspecting extremely small wire diameters at high speeds is now possible with Viscom’s S6053BO-V wire bond AOI system.

Janco Electronics earns IPC Certification for Lead–Free Electronics Assembly Process Capability

Monday, 22 September 2008 06:00

The program provides EMS and OEM facilities with tools to benchmark their existing lead-free processes and assess their abilities to meet the requirements of the RoHS Directive.

GOEPEL electronic showcases fusion of Debug/Emulation and JTAG/Boundary Scan Equipment at ITC

Monday, 22 September 2008 06:00

At ITC 2008 the company will exhibit its latest Boundary Scan hardware and software solutions for IEEE 1149.1, 1149.4, 1149.6, and 1532, as well as future standards such as IEEE P1149.7, P1687, and P1581.

Invitation for Taitronics Autumn 2008

Monday, 22 September 2008 06:00

Taitronics Autumn - Taipei International Electronics Show
Date: October 07-11, 2008
Venue: TWTC Nangang Exhibition Hall, Taipei


Mentor Graphics and PTC Deliver Industry’s First Bi–Directional ECAD

Monday, 22 September 2008 06:00

To find out more please attend a joint webinar being broadcast live September 23 or on demand....


Monday, 22 September 2008 06:00

SUSS now holds the globally recognized ISO 9001 certification for having established a high level process and system-oriented quality management (QM) based on ISO 9001 standards.



Monday, 22 September 2008 06:00

The SMTA honored members who have shown exceptional service to the association and the industry.

IPC/SMTA High–Performance Electronics Assembly Cleaning Symposium Announces Session Three Speak

Monday, 22 September 2008 06:00

The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O’Hare in Rosemont, IL on October 28-29, 2008.

Jasbir Bath to retain as a Consulting Engineer at Christopher Associates

Monday, 22 September 2008 06:00

Christopher Associates today announced that Jasbir Bath of Bath Technical Consultancy has been retained as a Consulting Engineer to advise and support the company and its customers in the Americas.

Learn important news for the fast growing PCB market in Europe: Russia

Friday, 19 September 2008 06:00

Electronics Manufacturing in Russia 23-25 September 2008
EIPC Conference: PCB's: Market and Technologies
24-25 September 2008, St. Petersburg, Russia

Exopack Advanced Coatings Marks First Year In North Carolina With Manufacturing Success

Friday, 19 September 2008 06:00

Exopack Advanced Coatings is surging ahead with the manufacturing of its core product lines following relocation of its operations from South Hadley, Mass. to Matthews, N.C.

SMART SYSTEMS INTEGRATION 2009 – Dont miss the deadline for submitting your abstract

Friday, 19 September 2008 06:00

Submit your abstract for SMART SYSTEMS INTEGRATION conference in Brussels, Belgium, 10 -11 March 2009!
The deadline is 07 October 2008.

Krayden, Inc. Appoints Salesman for Utah, Idaho and New Mexico

Friday, 19 September 2008 06:00

The knowledge and experience Eric gained will apply to his new position within Krayden, helping him provide customers with advanced resources and service.

Balver Zinn Appoints Distributor PROSEM Technology to Support SMT Business in India

Friday, 19 September 2008 06:00

Balver Zinn and PROSEM TechnologyWith verbal agreement reached in early September, this appointment will provide customers in India with local access to Balver Zinn’s world-renowned Cobar range of SMT products, including pastes, fluxes and wires.

ECTC 2009: Deadline to submit an abstract or PDC proposal is less than one month away

Friday, 19 September 2008 06:00

Submit your abstract or Professional Development Course proposal today! Deadline is October 15, less than one month away.


Digi–Key Corporation and HI–TECH Software Announce Worldwide Distribution Agreement

Friday, 19 September 2008 06:00

HI-TECH products stocked by Digi-Key are featured in its print and online catalogs and are available for purchase directly from Digi-Key.


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