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The global assembly journal for SMT and advanced packaging professionals



Global SMT & Packaging Magazine

Global SMT & Packaging Magazine
15.07 Read it Online




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Industry News

New TSV report on Toshiba's CMOS image sensor

Thursday, 20 November 2008 06:00

This new report features three different chapters presenting the CMOS image sensor market perspectives, a technical analysis and a reverse costing analysis of the first high volume Through Silicon Via implementation.

 

ELCINA PARTNERS WITH COMPONEX NEPCON

Thursday, 20 November 2008 06:00

The association has been successfully transforming the face of the electronics industry in India.
   

Advanced Packaging Market New offer available

Wednesday, 19 November 2008 06:00

Our next live webcast: November 26 at 10.00 am on: Wafer Level Packaging: Technologies & Market Analysis - 3D ICs Devices & Systems - 3D ICs Equipment.
 

Daleba Restructures for Global Success

Wednesday, 19 November 2008 06:00

Andrew Grisbrooke, Operations Director of the TCL GroupThis strategic move will enable Daleba to better support the increase in demand they are witnessing in Asia...

   

Bliss Industries Promotes Shana Bradshaw to Sales Manager

Wednesday, 19 November 2008 06:00

Shana Bradshaw will now lead the team as Sales Manager at Bliss Industries.Account Manager Shana Bradshaw will now lead the team as Sales Manager.
 

Krayden, Kraydenmex Partner with Henkel as Full Line Henkel Electronics Distributor

Wednesday, 19 November 2008 06:00

The electronics group of Henkel is the market’s leading developer and supplier of material solutions for electronics packaging and assembly.
   

FINE LINE STENCIL Opens Memphis, TN Stencil Manufacturing Facility

Wednesday, 19 November 2008 06:00

The facility is located five minutes from Federal Express’ main U.S. hub and gives the company the ability to ship stencils up to midnight CST.
 

K.R. Anderson, Inc. Partners with Henkel as Full Line Henkel Electronics Distributor

Wednesday, 19 November 2008 06:00

The electronics group of Henkel is the market’s leading developer and supplier of material solutions for electronics packaging and assembly.
   

Mekoprint solves screen print problems with Teknek

Tuesday, 18 November 2008 08:00

The contact cleaners are being used on two high volume screen printing production lines which produce printed circuits for mobile telephone antennae and loudspeakers.
 

SMTA International issues 2009 Call for Papers

Tuesday, 18 November 2008 06:00

This year’s event will be held October 4 to 8, 2009 at the Town and Country Resort and Convention Center in San Diego, CA.

   

CheckSum Announces Distribution Agreement with CPS in Poland

Tuesday, 18 November 2008 06:00

CPS-IEP has already sold and installed an Analyst ems 12KN tester into a major manufacturer of lighting products in Poland.

 

IPC Releases REACH Guidebook As Pre–Registration Deadline Approaches

Tuesday, 18 November 2008 06:00

REACH took effect on June 1, 2007, and gives greater responsibility to industry to manage the risks from chemicals and to provide safety information on the substances used in their products.

   

2008 International Wafer–Level Packaging Conference Delivers During Tough Times

Monday, 17 November 2008 06:00

The four-day program began with two-days of half-day tutorials on topics ranging from IC Packaging to Failure Modes & Analysis of Flip-Chip Assemblies given by leading instructors in the industry.
 

MVP Introduces Updated Web Site and Rollout of Enhanced Service Tools

Monday, 17 November 2008 06:00

Listening to our customers’ needs we have focused the new site at providing easier access to our support services and product information.
   

National Electronics Week delivers unbeatable value for 2009 marketing budgets

Monday, 17 November 2008 06:00

The multi-tiered pricing system is designed to help exhibitors make the most of their marketing budget,.....

 

 

KIC Appoints Etek Europe Ltd. as Distributor for Hungary and Romania

Monday, 17 November 2008 06:00

The company is committed to providing customers with the highest standard of equipment, process and technical support.

   

T–Mobile G1 Carries $143.89 BOM Cost, According to iSuppli Estimate

Monday, 17 November 2008 06:00

The most costly segment of the G1 is the baseband, at $28.49, or 19.8 percent of the G1's total BOM.
 

Cognex appoints Thomas F. Nash as President of its Surface Inspection Systems Division

Monday, 17 November 2008 06:00

Tom Nash of CognexPrior to his career at BTU he served as President of CIMCIS Ltd., a start-up software company that develops real-time process control software for the electronics assembly market.

   

UK Government and ITGI release guide on IT Governance and Value

Friday, 14 November 2008 06:00

Guide Aligning COBIT 4.1, ITIL V3 and ISO 27002 Helps Enterprises Achieve Maximum Governance and Value in a Volatile Economy

 

IMEC and Panasonic Sign Comprehensive Joint Research Contract

Friday, 14 November 2008 06:00

Cutting-edge CMOS processes and More than Moore (networks, wireless, and biomedical) featured
   

Anders and Tilcon to deliver enhanced user machine relationships with Microsoft Windows Embedded CE

Friday, 14 November 2008 06:00

Joint venture between display and GUI specialists enable ultimate user experience

 

IPC Delivers Comments to the U.S. Consumer Product Safety Commission Regarding Electronic Devices

Friday, 14 November 2008 06:00

The new CPSIA regulations also require manufacturers to certify compliance with every consumer product shipment beginning November 12, 2008.
   

Prime Axis Manufacturing Now Offers Machining of Parts on Swiss Turning Centers

Friday, 14 November 2008 06:00

Prime Axis Manufacturing Now Offers Machining of Parts on Swiss Turning CentersMachining of small precision parts is ideal for applications in medical, optics, telecommunications, aerospace, instrumentation, and mold inserts.
 

STI Electronics, Inc. Recognized by Inc. Magazine®

Friday, 14 November 2008 06:00

STI Electronics, Inc., announces that it has been recognized as one of the fastest growing privately held companies by Inc. magazine.

   

Sissie Eckstein Celebrates a Decade with STI

Friday, 14 November 2008 06:00

Sissie Eckstein, STI Electronics Inc.STI Electronics Inc., announces that November marks Sissie Eckstein’s 10th anniversary.
 

Bob Willis Recognized By His Peers Again!

Friday, 14 November 2008 06:00

Bob WillisDuring the recent Awards Luncheon at the 2008 IPC Midwest Conference and Exhibition Bob’s efforts were acknowledged within a group of 300 of his peers.
   

CyberOptics Semiconductor names Ferris Chen director of Asian sales

Wednesday, 12 November 2008 14:57

Chen will manage growth of the company's WaferSense® brand in the region and implementations at fabs in Taiwan, China, Singapore and Malaysia.

 

IPC APEX EXPO™ exhibition more than 85 percent sold

Wednesday, 12 November 2008 14:54

The exhibition and premier technical conference will take place March 31

   

Charlie Cuneo joins JPSA Laser as president

Tuesday, 11 November 2008 13:15

Cuneo takes over responsibilities as president from Jefferey P. Sercel, founder, who will continue at the company as chairman and chief technical officer.

 

IPC releases REACH Guidebook as pre–registration deadline approaches

Tuesday, 11 November 2008 13:14

IPC

   

DfR Solutions to present in England at Technology World 2008

Tuesday, 11 November 2008 13:12

Dr. Craig Hillman to discuss common design for reliability (DfR) mistakes.

 

K.R. Anderson partners with Henkel as full line Henkel Electronics distributor

Tuesday, 11 November 2008 13:12

K.R. Anderson, Inc., a distributor of engineered materials, announces that it has partnered with Henkel Corporation as a full line distributor of Henkel’s electronics materials.

   

North China’s Bohai Electronics Week (BEW 08) opens today

Monday, 10 November 2008 13:58

Held at the Tianjin International Exhibition Centre, the show provides an unparalleled opportunity for the region to experience the latest products and innovations the electronics manufacturing market has to offer.

 

FINE LINE STENCIL opens Memphis, TN, stencil manufacturing facility

Monday, 10 November 2008 13:57

The facility is located five minutes from Federal Express’ main U.S. hub and gives the company the ability to ship stencils up to midnight CST. 

   

Camtek cuts workforce

Monday, 10 November 2008 13:56

The reduction represents about 12% of the company's total workforce.

 

IPC Materials Conference call for papers

Monday, 10 November 2008 13:55

IPC is sponsoring a conference devoted to the exchange of information on leading edge electronic materials.

   

Krayden, Kraydenmex partner with Henkel as full line Henkel Electronics distributors

Monday, 10 November 2008 13:54

Krayden and Kraydenmex are full line distributors of Henkel’s leading electronics materials brands including Loctite® Hysol®, Multicore®, and Emerson & Cuming.

 

Pac Tech held Grand Opening Celebration for their New Asian Facility

Friday, 07 November 2008 06:00

Pac Tech Ribbon Cutting: Formal ribbon cutting was conducted by, from left to right is: Ghassem Azdasht (CTO - Pac Tech GmbH), Dr. Elke Zakel (CEO & President,Pac Tech Group), Tuan Lim Guan Eng (Chief Minister of Penang), Hiroshi Nagase (President, NAGASE & CO.,LTD, Tokyo), and Dato' Lee Kah Choon (President, Invest-in-Penang Berhad)On September 18 Pac Tech held their grand opening celebration for their new facility in Penang, Malaysia.
   

Exerra Correction

Thursday, 06 November 2008 15:06

From the November 6, 2008, newscast.

 

MYDATA appoints new managing director in China

Thursday, 06 November 2008 15:06

From the November 6, 2008, newscast.

   

Infineon chief asks German government to support chip industry

Thursday, 06 November 2008 15:03

From the November 6, 2008, newscast.

 

Sony second–quarter profits plunge 72%

Thursday, 06 November 2008 15:02

From the November 6, 2008, newscast.

   

IPC Voices Concerns Over RoHS Revision Developments

Thursday, 06 November 2008 15:00

From the November 6, 2008, newscast.

 

Seica opens new demo and support center

Thursday, 06 November 2008 14:59

From the November 6, 2008, video newscast.

   

Sony adds performance, flexibility and colour to its next generation smart camera line–up

Thursday, 06 November 2008 06:00

Sony XCI seriesOpen FPGA and powerful CPU leads to new smart camera application
 

congatec wins "Best Business Award"

Thursday, 06 November 2008 06:00

(from left to the right) Erwin Huber, former Bavarian finance minister, Gerhard Edi, CEO of congatec and Rudolf Fellner, founder of Best Business Awards.Awards for young and successful companies from the three-country region that includes Eastern Bavaria, Upper Austria and Southern Bohemia.
   

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