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Special Features

Productions Solutions to debut new RED-E-SET XHD line at SMTAI

Written by dburford Friday, 20 September 2013 07:04

Production_Solutions_RED-E-SET_XHDProduction Solutions Inc., manufacturer of the industry-leading RED-E-SET Board Support System, announces that it will debut its new line of RED-E-SET Xtra High Density (XHD) products in Booth #914 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
 

ACE to demonstrate latest selective soldering technology at SMTAI

Written by dburford Thursday, 19 September 2013 16:27

KISS-105ACE Production Technologies, Inc., a supplier of selective soldering systems, will exhibit its newest generation of the popular KISS-104 selective soldering system at SMTA International 2013, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Fort Worth, Texas.
The KISS-104 is capable of soldering printed circuit boards up to 18” x 24” (457mm x 610mm) and many leading edge features are included as standard.

   

FCT Assembly’s Tony Lentz to present during SMTA International 2013

Written by dburford Thursday, 19 September 2013 12:20

FCT_Assembly_Tony_LentzFCT Assembly announced that Tony Lentz will be presenting “Can Nano Coatings Really Improve Stencil Performance?” during technical session SMT2 “Performance of Stencil Applied Coatings” at SMTA International in Fort Worth, TX.  Technical session SMT2 is scheduled to take place on Tuesday, October 15 from 4-5:30 p.m. in room 202C of the Fort Worth Convention Center.

 

Kyzen to be represented in 3 technical sessions at SMTA International 2013

Written by dburford Thursday, 19 September 2013 12:08

Kyzen_Mike_BixenmanTechnical Session HE6 “Manufacturing for Harsh Environments” is scheduled to take place Tuesday, October 15 from 4pm-5:30pm in room 202A of the Fort Worth Convention Center.  The presentation, entitled Copper Corrosion Effects from Cleaning Agent Entrapment, will be co-presented by Kyzen’s David Lober and Mike Bixenman, DBA, in conjunction with Linda Woody of Lockheed Martin.
   

ECT technical expert to discuss breakthrough PCBA test probe technologies at SMTAI 2013

Written by dburford Thursday, 19 September 2013 12:02

Everett Charles Technologies’ (ECT) announced that Brian Crisp will present at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. The presentation, entitled “Probe Technologies to Improve First Pass Yields,” will be held during Session LF4, “Actively Improving Your Soldering Process,” on Thursday, October 17, 2013 from 3:30 – 5 p.m. in Room 204A.

 

Nordson DAGE’s Evstatin Krastev, Ph.D. to present at SMTA International 2013

Written by dburford Thursday, 19 September 2013 10:53

Nordson_DAGE_Evstatin_KrastevNordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is delighted to announce that Evstatin Krastev, Ph.D., partnered with Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger and Murad Kurwa of FLEXTRONICS International Inc., and Zohair Mehkri of Santa Clara University, will be presenting their paper titled, “2D/3D X-Ray Inspection: Process Control and Development Tool” during technical session PRC2 Imaging, Inspection and Quality at the upcoming SMTA International in Fort Worth Texas.

   

FCT Assembly to demonstrate new technology for paste printing during SMTAI

Written by dburford Wednesday, 18 September 2013 09:46

FCT_NanoCoat_Multilayer_SystemFCT Assembly announces that it will exhibit its new NanoSlic™ stencil in Booth #410 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. NanoSlic™ is the world’s most advanced stencil technology for solder paste printing.

 

Ellsworth Adhesives is exhibiting at SMTA International

Written by dburford Wednesday, 18 September 2013 09:30

Ellsworth Adhesives is pleased to announce that they will be exhibiting at this year’s SMTA International Exhibition at the Fort Worth Convention Center in Fort Worth, Texas, October 15 - 16, 2013.
Ellsworth Adhesives will be displaying the latest technology of adhesives and dispensing equipment in Booth 421.

   

VJE’s Don Naugler and BEST’s Bob Wetterman to present during technical session SMT3 at SMTA International 2013

Written by dburford Wednesday, 18 September 2013 07:55

VJE_Don_NauglerVJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.  The paper, titled, “Ultra-Fine Pitch Deballing and Reballing-What Needs to Change?” is scheduled to take place during Technical Session SMT3 on Wednesday, October 16, 2013 from 8:00am-9:30am in room 202C of the Fort Worth Convention Center.

 

SEHO Systems’ Christian Ott to discuss costs of soldering in nitrogen atmospheres at SMTAI

Written by dburford Wednesday, 18 September 2013 00:00

SEHO_Christian_OttSEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled, “Soldering in Nitrogen Atmosphere – Do Quality Aspects Justify the Costs?” at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. The presentation will be held during

   

Viscom brings S3088 AOI with quality uplink to SMTAI

Written by dburford Wednesday, 18 September 2013 00:00

Viscom_S3088QCViscom announced that it will exhibit the S3088 AOI system in Booth #427 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. The system will be displayed with the unique Quality Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.

 

Inovaxe to exhibit its suite of material handling solutions at SMTA International

Written by dburford Wednesday, 18 September 2013 00:00

Inovaxe_InoKit_Cart_with_ReelsInovaxe, a world leader and provider of innovative material handling and inventory control systems, will exhibit in Booth #212 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Inovaxe will highlight its Ultra Lean Total Material Handling and Storage Solution that addresses the challenges of dealing with SMT parts and kits within the stockroom and WIP locations.

   

Nihon Superior’s Keith Sweatman to introduce novel lead-free alloy for elevated temperature service at SMTA International

Written by dburford Tuesday, 17 September 2013 18:45

Nihon_Superior_Keith_SweatmanNihon Superior, a supplier of advanced soldering materials to the global market, announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas. The paper, entitled Modified Hypereutectic Sn-Cu-Pb-free Solder for Power Semiconductor Die Attach, will be presented during technical session HE3 “Power Electronics Packaging” on Monday, October 14 from 1:30-3 p.m. in room 202A.

 

Meet with the one-stop source for engineering, training and distribution services at SMTA International

Written by dburford Tuesday, 17 September 2013 17:36

STI_Training_Services_LRSTI Electronics, Inc. announces that it will exhibit in Booth #301 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. STI is a full service organization and company representatives will discuss its full range of services at the show, including training services, electronic and industrial distribution, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly.
   

Alpha to present technical papers at SMTA International, Fort Worth, TX

Written by dburford Tuesday, 17 September 2013 16:37

Alpha, the world leader in the development and production of electronic soldering materials, will attend SMTA International, in Fort Worth, TX on Oct. 13-17, Booth 516 and present two technical papers: “Elimination of Wave Soldering with Low Melting Point Solder Paste’ and “Low Temperature Alloy Development for Electronics Assembly – Part II.”

 

ASM Assembly Systems at Productronica 2013

Written by dburford Tuesday, 17 September 2013 13:28

SIPLACE_productronicaWith its presence at the Productronica 2013 trade show (November 12-15, Messe München), ASM Assembly continues to solidify its position as a global innovation and technology leader in electronics manufacturing equipment. Since experts believe that optimizing the overall production process harbors the greatest efficiency reserves, the SIPLACE team is centering its show presence around role- and production-specific workflows.
   

Nihon Superior to bring the latest developments in solder technology to SMTAI

Written by dburford Tuesday, 17 September 2013 00:00

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #504 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection, and process yields.

 

SMTA International Electronics Exhibition booth space sold out

Written by dburford Wednesday, 11 September 2013 00:00

One hundred and seventy companies have reserved their booth space at SMTA International, making it the largest SMTA exhibition to date. Exhibiting company profiles include suppliers of capital equipment, materials, tools, cleaning solutions, stencils, board shops, electronics manufacturing services, rep groups, media, and more. Exhibitors are encouraged to join a waitlist if they did not yet get a booth.

   

Awarded optical and electronic test and measurement technologies at productronica

Written by dburford Monday, 09 September 2013 16:33

OptiCon_THT-Line_InlineAt 2013 productronica in Munich, GOEPEL electronic will exhibit multiple award winning inspection and test solutions based on optical and electronic technologies. At Stand A1.239 the company will demonstrate how to decisively optimize throughput and fault coverage through wise application of respective test engineering. GOEPEL electronic will not only be represented as a multi technology vendor but also as a consultant and service provider comprehensively supporting users in terms of quality assurance.
 

Speedline Technologies to exhibit printing, dispense solutions at SMTAI 2013; presenting in the technical conference

Written by dburford Monday, 09 September 2013 00:00

EnclosedFlowSpeedline Technologies will be exhibiting newly-introduced equipment and participating in the technical conference at SMTA International 2013 at the Fort Worth Convention Center, Fort Worth, Texas.
Speedline’s latest printing and dispense solutions introduced in 2013 include the MPM® Momentum™ Compact printer and CAMALOT® Prodigy™ dispense systems, new to the industry in 2013, in booth #602, for the exhibition Oct. 15 - 16, 2013.

   

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