• Metallization options for optimum chip-on-board assembly by Mukul Luthra, Waterfall Technologies
• BGA assembly reliability—PWB quality is key by Tom Clifford, TJB Associates
• Trace, track and control: high production output at low costs by François Monette, Cogiscan Inc. and Matt Van Bogart, Microscan Systems, Inc.

• Guidelines for establishing a lead-free wave soldering process for high-reliability by J. Scott Nelson, Harris Corporation
• Process challenges and solutions for embedding chip-onboard into mainstream SMT assembly by Mukul Luthra, Waterfall Technologies
• Trace, track and control: high production output at low costs by François Monette, Cogiscan Inc. and Matt Van Bogart, Microscan
  Systems, Inc.

• Investigation and development of tin-lead and lead-free solder pastes to reduce head-in-pillow defects by Jasbir Bath and Roberto Garcia, Christopher Associates Inc., and Noriyoshi Uchida, Hajime Takahashi, Gordon Clark, Manabu Itoh, Koki Solder
• China’s export trade for gray-market handsets by Kevin Wang, iSuppli
• Combating counterfeit components

• Safe detection of hidden faults - Jens Kokott, GOEPEL electronic
  
• Reducing copper dissolution in lead-free assembly - D. Di Maio, C. P. Hunt and B. Willis
  
• Collaborative cleaning process innovations from managing experience and learning curves - Mike Bixenman, DBA and Dirk Ellis, Kyzen Corporation, and John Neiderman, Speedline Technologies

and more!

• What you need to know before buying your AOI solution by Paul Groome, Machine Vision Products
• Which tools are best for SMT rework

• PoP (package on package) and vapor phase technology

• "Establishing a precision stencil printing process for miniaturized electronics assembly" by Chris Anglin, Indium Corporation
• "Moving AOI beyond the grey world" by Shoich Rashed, Marantz Business Electronics Europe
• "Solder joint reliability: acceleration transforms and acceleration factors" by Werner Engelmaier
  

• "RoHS war stories" by Bev Christian, Research In Motion, and Michael Fry, Intertek Ageus Solutions
• "Energy measurement: The main metric for high strain rate bond testing of solder balls" by Dr. Stephen Clark, Dage Precision Industries
• "A revolution in wave soldering" by Peter Grundy, ITM Consulting

• "Metal-based wafer level packaging" by Shari Farrens, Ph.D., SUSS MicroTec
• "Cost reduction of wafer level packaging by using established materials from non-electronics industries" by Giles Humpston, Tessera
• "Case Study: Reducing recall risk down to no more than three PCB panels"

• "EMS

• Hot air solder leveling in the lead-free era 
  Keith Sweatman, Nihon Superior Co., Ltd
• Vapor phase vs. convection reflow in RoHS-compliant assembly
  Dan Coada, EPIC Technologies
• Conquering SMT stencil printing challenges with today’s miniature components
  Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.

And more!

• iNEMI project evaluates BFR-free PCB materials
  Stephen Tisdale, Gary B. Long, Roger Krabbenhoft, Kostas Papathomas, Ph.D., and Terry Fischer
• PoP: An EMS perspective on assembly, rework and reliability Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell and Roden Cortero
• Efficient line changeover: the key to lean manufacturing
  Douglas Farlow

• Strain gage testing: the delta effect of thermal cycle testing
  by Mark T. McMeen
• Resolution of solder voids in pin-in-hole product by Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang.
• A new angle on printing
  George Babka, Scott Zerkle, Frank Andres, Rahul Raut, Westin Bent and Dave Connell

And more!

• Electrostatic discharge (ESD) and automated handling processes
  Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD Competence Centre
• PCB layout and soldering nozzle design in selective soldering processes Reiner Zoch, SEHO Systems GmbH
• Supporting niche service needs at a regional level

• "Electrostatic discharge (ESD) and automated handling processes" by Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD Competence Centr
• "PCB layout and soldering nozzle design in selective soldering processes" by Reiner Zoch, SEHO Systems Gmb
• "Supporting niche service needs at a regional level

2008 World Distributor Review

• "Molded underfill process for the SiP" Tae Hyun Kim, Ki Chan Kim, Sung Yi, Dong-Kuk Kim, Tae Sung Jung, Jin Su Kim, and Joseph Y. Lee, Samsung Electro-Mechanics Co., Ltd.
• "Thermally conductive liquid materials for electronics packaging" by Sanjay Misra, Ph.D., The Bergquist Company
• "Reflow significance on package-on-package reflow assembly" by S. Manian Ramkumar, Ph.D., RIT, and Brian O’Leary, KIC 

And more...

• Test data requirements for assessment of alternative Pb-free solder alloys by Helen Holder, Gregory Henshall, Aileen Maloney, et al, Hewlett-Packard Company
• Lasers

• 01005 assembly process

• "Optimizing batch cleaning for removing lead-free flux residues on PCA" by Steve Stach, Austin American Corporation, and Mike Bixenman, DBA, Kyzen Corporation
  
  "Compatibility of polymers and fluxes: Getting to the heart of the matter" by Andy Mackie, Ph.D., and Christopher Nash, Indium Corporation
  
  "A Breath of Fresh Air" by Claude W. "Bubba" Powers, Cooper Hand Tools

and more...

• "Advances in solder ball placement for surface-mountable packages" by Tom Falcon, DEK Printing Machines Ltd
• "Understanding hidden reactions and the importance of profile in reflow soldering, part 2" by Dr. S. Manian Ramkumar, Mr. Anand Kannabiran and Ms. Aarthi Baskaran, CEMA at RIT; Dr. Viswam Puligandla; Mr. Bjorn Dahle, KIC
• "Parallel print & inspection processes to achieve 100% post-print inspection" by Wolfram H