Ramp to volume by Matt WeunschTuesday, April 5, 2011
—In the December issue of Global SMT & Packaging magazine, Mark Laing’s article “New Product Introduction” took a look at the critical elements of performing a new product introduction (NPI), which is essentially the first step in taking a product from the design environment into volume production.
Experiences in transferring recipes from an eight-zone reflow oven by Fred DimockTuesday, April 5, 2011
—This practical presentation describes the methodology used to quickly transfer numerous recipes from an eight-zone reflow oven to a ten-zone oven for a high mix contract manufacturer.
Solderless interconnection technologies - a brief retrospective by Joe FjelstadTuesday, April 5, 2011
—Many improved technologies when marketed to the industry are often positioned and perceived as new and/or novel. However, one will often find with a little digging that the “new” technology has more history than is often visible at first glance.
Streamlining new product introduction by Mark LaingTuesday, February 22, 2011
—A PCB assembler’s single largest cost of producing a printed circuit board (PCB) is the components themselves.
Clean “no-clean,” or use a water wash solder paste? by Gerjan Diepstraten and Tim Lawrence, Ph.D.Tuesday, February 22, 2011
—Since the demise of CFCs as a cleaning option in the 1970s, “no clean" fluxing technology has become increasingly popular in electronics assembly. The benefits include a reduced number of process steps, simpler qualification with no need to specify cleaning detail and reduced cost.
IC package development—meeting the constant challenge of change by Joe FjelstadThursday, January 6, 2011
—History is replete with stories of the rise and fall of nations.
LED BIN validation & traceability by Dan HodgmanThursday, January 6, 2011
—The increased use of LEDs introduces significant new challenges for the electronic PCB assembler.
PEC (printed electronic circuit) process for LED interconnection by Mike DuBoisThursday, January 6, 2011
—PCB mounting of LEDs has to date been limited to mechanical interconnection or the use of printed circuits boards built on thermally conductive copper clad aluminum substrates.
Printed electronics for flexible solid-state lighting by Marc ChasonThursday, January 6, 2011
—Printed electronics technologies are being introduced as competitors to crystalline semiconductor technologies in several applications, including logic circuits, photovoltaic cells and light emitting diodes (LED).
Comparing electronics manufacturing transformation costs in various geographies by Charlie BarnhartThursday, January 6, 2011
—The penetration rate for EMS has historically been defined as the percentage of total available market (TAM) in electronics that has been captured by electronics manufacturing services providers, whether traditional contract manufacturers, original design manufacturers (ODM) joint design manufacturers (JDM) or any of the other business models that developed as the industry has evolved.
3D—the once and future solution for electronic interconnections by Joe FjelstadTuesday, January 4, 2011
—While there is a natural tendency to be enamored of the latest and greatest technological advances as harbingers of things to come, with a little bit of digging one can often find that many of those things sprouted from seeds planted long ago.
21st century manufacturing software solutions by Matt WeunschTuesday, January 4, 2011
—Today’s comprehensive CIM/CAM solutions provide an unprecedented ability for electronics manufacturers to have incredible visibility into their manufacturing operations.
How to use 3D solder paste inspection (SPI) to improve SMT printing process by Anxin NingTuesday, January 4, 2011
—According to some study, about 60-80% of the defects in the entire SMT are due to print quality.
THT in-line inspection: contradiction or greater efficiency? by Jens KokottTuesday, January 4, 2011
—Automated optical inspection is most commonly used for SMD assemblies.
Parts management by Frank Frank and Nolan JohnsonTuesday, January 4, 2011
—Almost 30 years after the fact, we’re still asking PCB designers to “build their own fonts” (so to speak) on a daily basis, to great expense.
How to increase production and reduce costs through optimized dynamic scheduling by Bill CrowleyTuesday, January 4, 2011
—The electronics assembly industry is changing rapidly.
Raised copper contact technologies for IC packaging—a path to improved reliability by Joe FjelstadMonday, January 3, 2011
—Interconnections are arguably the most critical element in electronic system design, and deservedly they are presently getting much greater attention than they have had in the past.
Predicting PCB delamination in lead-free assembly by Geert Willems, PhD, and Piet Watté, PhDMonday, January 3, 2011
—Selecting the right FR4-type laminate for a lead-free solder printed board assembly (PBA) has become a critical but difficult task for the PCB designer.
A better dispense tip by Frank Murch and Eiji ItoMonday, January 3, 2011
—The designs, construction and materials used to make dispensing needles date back to the first medical injections in the mid 1800s
Fast heat-curing adhesives for packaging by Dr. Karl Blitzer and René Tobisch-HauptMonday, January 3, 2011
—Higher throughputs in microelectronics and packaging are the ultimate goal set by manufacturers of electronic components.
Crystal ball: second half 2010 and 2011 by Walt Custer & Jon Custer-TopaiFriday, September 10, 2010
—The global electronic industry recovered significantly in the second quarter, but uncertainty lies ahead due to fragile economics, possible component inventory builds and weakening end market demand.
Matching the cleaning agent to the flux residue by Dr. Mike BixenmanThursday, September 9, 2010
—Understanding the effects of solder flux residues is critical to matching the cleaning agent to the residue, and matching the cleaning agent to the residue is key to effective and efficient cleaning.
Evaluating the accuracy of a non-destructive thermocouple attach method for area-array package profiling by Tim Grove, Dr. S. Manian Ramkumar, Brian O'LearyThursday, September 9, 2010
—Area-array packages have solder balls hidden under the package, making it particularly difficult to achieve the correct thermal profile. Improper melting of solder balls will lead to poor solder joint formation and will damage the BGAs or the entire assembly.
The printed circuit—the unsung bellwether of electronics manufacturing evolution by Joe FjelstadThursday, September 9, 2010
—The printed circuit is one of the most common icons of electronics, and yet at the same time it is arguably the most unappreciated element of the world of electronics production.
Caution in the face of high growth by Walt Custer & Jon Custer-TopaiFriday, August 6, 2010
—2010 is certainly a year of recovery. Second quarter global electronic equipment sales could be up 25%+ compared to the same quarter in 2009, and May 2010 world semiconductor shipments set an all time record high.