AIM’s Derek Wang to Present at the SMTA China East Vendor Conference on April 26th, 2017

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Derek Wang, Technical Support Manager, will present at the SMTA China East Vendor Conference on April 26th, 2017 at the Shanghai World Expo Exhibition & Convention Center in Shanghai, China.

Derek’s presentation, scheduled for Wednesday, April 26th, 2017 from 11-11:25 AM, will highlight AIM’s REL61™, a low-cost, high reliability alternative to SAC305 and low-/no-silver alloys. REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically voiding, cost, durability and tin whiskers. Combined with AIM M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45%, increasing both thermal performance and solder joint integrity. Extensive testing indicates that REL61 can reduce tin whisker formation as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance. Additionally, it will highlight key characteristics of AIM’s newly developed REL22™ solder alloy for extremely harsh environments.

Derek Wang is a Technical Support Manager for AIM Solder. He is a SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over thirteen years’ experience in the SMT industry, Derek supports AIM customers in Eastern China.

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