AIM’s Timothy O’Neill to present at TEC Warsaw on May 25th, 2017
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Timothy O’Neill, Technical Marketing Manager, will present at TEC Warsaw on May 25th, 2017 at the Double Tree by Hilton Hotel & Conference Centre in Warsaw, Poland. Additionally, AIM will highlight its revolutionary REL61™ lead-free solder alloy, along with its full line of solder assembly materials.
Mr. O’Neill will present the white paper “New Pb-free Alloys for Improved Reliability,” at the technical forum from 10:30 – 11:00 AM. This paper addresses the development of high reliability soldering materials that can perform in harsh service conditions. Applications such has high performance LED lighting and under hood automotive require solder alloys to operate at temperatures as high as 150 °C where commonly used SAC305 could be prone to failure. In this study a novel high reliability lead-free solder alloy with superior creep resistance and mechanical properties is introduced and the soldering and mechanical performance of this alloy is studied and compared with the reference SAC alloy.
AIM will also highlight its innovative high reliability, lead-free solder alloys. REL61TM addresses the most challenging issues with today’s common lead-free alloys, specifically BTC voiding, cost, durability and tin whiskers. REL61TM offers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and other low/no-silver solder alloys. REL22™ is a high reliability, high strength lead-free solder alloy for extreme service environments, with reliability equal to Sn/Ag/Bi/Sb/Ni/Cu and a wider process window. To discover all of AIM’s products and services, visit the company at TEC Warsaw for more information.
About Timothy O’Neill
Timothy O’Neill is the Technical Marketing Manager for AIM Solder. With nearly 25 years of experience in electronics soldering, Mr. O’Neill has co-authored several papers on PCB assembly subjects. He is a Certified IPC Specialist, a technical writer and presenter for industry trade publications and events. His commitment and dedication to sharing innovative solutions to challenging problems in the electronics assembly market have earned him recognition from the SMTA as Speaker of Distinction.